Memory Products For Sale - PDF - Integrated Circuits (ICs) -Page10

Image	Part #	Manufacturer	Description	Availability	Pricing	Quantity	Factory Lead Time	Mount	Mounting Type	Package / Case	Surface Mount	Number of Pins	Supplier Device Package	Number of Terminals	Access Time-Max	Base Product Number	Brand	Clock Frequency-Max (fCLK)	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	Interface Type	Manufacturer	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Temperature	Memory Types	Mfr	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting Styles	Number of Words	Number of Words Code	Operating Temperature-Max	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom (Vsup)	Tradename	Operating Temperature	Packaging	Published	Series	JESD-609 Code	Pbfree Code	Part Status	Moisture Sensitivity Level (MSL)	Number of Terminations	ECCN Code	Type	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Subcategory	Technology	Voltage - Supply	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Supply Voltage	Terminal Pitch	Reach Compliance Code	Frequency	Time@Peak Reflow Temperature-Max (s)	Pin Count	JESD-30 Code	Qualification Status	Operating Supply Voltage	Supply Voltage-Max (Vsup)	Power Supplies	Temperature Grade	Supply Voltage-Min (Vsup)	Interface	Memory Size	Number of Ports	Nominal Supply Current	Speed	Operating Mode	Clock Frequency	Supply Current-Max	Access Time	Memory Format	Memory Interface	Data Bus Width	Organization	Output Characteristics	Seated Height-Max	Memory Width	Write Cycle Time - Word, Page	Address Bus Width	Product Type	Density	Standby Current-Max	Memory Density	Max Frequency	Parallel/Serial	I/O Type	Sync/Async	Word Size	Memory IC Type	Programming Voltage	Serial Bus Type	Endurance	Write Cycle Time-Max (tWC)	Data Retention Time-Min	Write Protection	Alternate Memory Width	Data Polling	Toggle Bit	Command User Interface	Number of Sectors/Size	Sector Size	Page Size	Boot Block	Refresh Cycles	Sequential Burst Length	Interleaved Burst Length	Access Mode	Product	Self Refresh	Product Category	Temperature	Memory Organization	Height Seated (Max)	Length	Width	Radiation Hardening	RoHS Status	Lead Free

Image	Part #	Manufacturer	Description	Availability	Quantity	Factory Lead Time	Mount	Mounting Type	Package / Case	Surface Mount	Number of Pins	Supplier Device Package	Number of Terminals	Access Time-Max	Base Product Number	Brand	Clock Frequency-Max (fCLK)	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	Interface Type	Manufacturer	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Temperature	Memory Types	Mfr	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting Styles	Number of Words	Number of Words Code	Operating Temperature-Max	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom (Vsup)	Tradename	Operating Temperature	Packaging	Published	Series	JESD-609 Code	Pbfree Code	Part Status	Moisture Sensitivity Level (MSL)	Number of Terminations	ECCN Code	Type	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Subcategory	Technology	Voltage - Supply	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Supply Voltage	Terminal Pitch	Reach Compliance Code	Frequency	Time@Peak Reflow Temperature-Max (s)	Pin Count	JESD-30 Code	Qualification Status	Operating Supply Voltage	Supply Voltage-Max (Vsup)	Power Supplies	Temperature Grade	Supply Voltage-Min (Vsup)	Interface	Memory Size	Number of Ports	Nominal Supply Current	Speed	Operating Mode	Clock Frequency	Supply Current-Max	Access Time	Memory Format	Memory Interface	Data Bus Width	Organization	Output Characteristics	Seated Height-Max	Memory Width	Write Cycle Time - Word, Page	Address Bus Width	Product Type	Density	Standby Current-Max	Memory Density	Max Frequency	Parallel/Serial	I/O Type	Sync/Async	Word Size	Memory IC Type	Programming Voltage	Serial Bus Type	Endurance	Write Cycle Time-Max (tWC)	Data Retention Time-Min	Write Protection	Alternate Memory Width	Data Polling	Toggle Bit	Command User Interface	Number of Sectors/Size	Sector Size	Page Size	Boot Block	Refresh Cycles	Sequential Burst Length	Interleaved Burst Length	Access Mode	Product	Self Refresh	Product Category	Temperature	Memory Organization	Height Seated (Max)	Length	Width	Radiation Hardening	RoHS Status	Lead Free
	Mfr. Part # W25X10BVSNIG Twicea Part # 888-535-W25X10BVSNIG	Winbond Electronics	IC FLASH 1M SPI 104MHZ 8SOIC Datasheet Compare	50000 In Stock	Min.:1 Mult.:1	-	Surface Mount	Surface Mount	8-SOIC (0.154, 3.90mm Width)	-	8	-	-	-	-	-	-	-	-	-	-	-	-	-	Non-Volatile	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-40°C~85°C TA	Tube	2008	SpiFlash®	-	-	Obsolete	3 (168 Hours)	8	EAR99	-	-	-	-	-	-	-	-	2.7V~3.6V	DUAL	-	-	1	3V	1.27mm	-	-	-	8	-	-	3.3V	3.6V	-	-	2.7V	SPI, Serial	1Mb 128K x 8	-	16.5mA	-	-	104MHz	-	7 ns	FLASH	SPI	-	1MX1	-	-	1	3ms	24b	-	1 Mb	0.000005A	-	-	-	-	Synchronous	1b	-	2.7V	SPI	100000 Write/Erase Cycles	-	20	HARDWARE/SOFTWARE	-	-	-	-	-	-	256B	-	-	-	-	-	-	-	-	-	-	1.72mm	-	-	No	ROHS3 Compliant	-
W25X10BVSNIG 888-535-W25X10BVSNIG Winbond Electronics RoHS : Package : - In Stock : 50000 1 : -
	Mfr. Part # W29N04GVSIAA Twicea Part # 888-535-W29N04GVSIAA	Winbond Electronics	IC FLASH 4G PARALLEL 48TSOP Datasheet Compare	1000 In Stock	Min.:1 Mult.:1	10 Weeks	-	Surface Mount	48-TFSOP (0.488, 12.40mm Width)	YES	-	-	-	-	-	-	-	-	-	-	-	-	-	-	Non-Volatile	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-40°C~85°C TA	Tray	2016	-	-	yes	Active	3 (168 Hours)	48	-	-	-	-	-	-	-	-	-	2.7V~3.6V	DUAL	-	-	1	3.3V	0.5mm	-	-	-	-	R-PDSO-G48	-	-	3.6V	-	-	2.7V	-	4Gb 512M x 8	-	-	-	ASYNCHRONOUS	-	-	-	FLASH	Parallel	-	512MX8	-	-	8	25ns	-	-	-	-	4294967296 bit	-	-	-	-	-	-	3.3V	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1.2mm	18.4mm	12mm	-	ROHS3 Compliant	-
W29N04GVSIAA 888-535-W29N04GVSIAA Winbond Electronics RoHS : Package : - In Stock : 1000 1 : -
	Mfr. Part # W25Q80BLSVIG Twicea Part # 888-535-W25Q80BLSVIG	Winbond Electronics	IC FLASH 8M SPI 80MHZ 8VSOP Datasheet Compare	1 In Stock	Min.:1 Mult.:1	-	-	Surface Mount	8-SOIC (0.154, 3.90mm Width)	YES	-	-	-	-	-	-	-	-	-	-	-	-	-	-	Non-Volatile	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-40°C~85°C TA	Tape & Reel (TR)	2016	SpiFlash®	-	-	Discontinued	3 (168 Hours)	8	-	-	-	-	-	-	-	-	-	2.3V~3.6V	DUAL	-	-	1	3V	1.27mm	-	-	-	-	R-PDSO-G8	-	-	3.6V	-	-	2.7V	SPI, Serial	8Mb 1M x 8	-	-	-	SYNCHRONOUS	80MHz	-	-	FLASH	SPI	-	8MX1	-	-	1	800μs	-	-	-	-	8388608 bit	-	-	-	-	-	-	3V	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	0.9mm	4.9mm	3.9mm	-	ROHS3 Compliant	-
W25Q80BLSVIG 888-535-W25Q80BLSVIG Winbond Electronics RoHS : Package : - In Stock : 1 1 : -
	Mfr. Part # W9825G6JH-6 Twicea Part # 888-535-W9825G6JH-6	Winbond	Synchronous DRAM, 16MX16, 5ns, CMOS, PDSO54, 0.400 INCH, 0.80 MM PITCH, ROHS COMPLIANT, TSOP2-54 Datasheet Compare	86400 In Stock	Min.:1 Mult.:1	-	-	-	-	YES	-	-	54	5 ns	-	-	166 MHz	-	WINBOND ELECTRONICS CORP	-	Winbond Electronics Corp	W9825G6JH-6	-	-	-	-	-	-	3	-	16777216 words	16000000	70 °C	PLASTIC/EPOXY	TSOP2	TSOP2, TSOP54,.46,32	TSOP54,.46,32	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	Obsolete	TSOP2	-	NOT SPECIFIED	8.43	-	Yes	-	-	3.3 V	-	-	-	-	-	e3	-	-	-	-	EAR99	-	Matte Tin (Sn) - annealed	-	-	AUTO/SELF REFRESH	8542.32.00.24	DRAMs	CMOS	-	DUAL	GULL WING	NOT SPECIFIED	1	-	0.8 mm	unknown	-	-	54	R-PDSO-G54	Not Qualified	-	3.6 V	3.3 V	COMMERCIAL	3 V	-	-	1	-	-	SYNCHRONOUS	-	0.08 mA	-	-	-	-	16MX16	3-STATE	1.2 mm	16	-	-	-	-	0.002 A	268435456 bit	-	-	COMMON	-	-	SYNCHRONOUS DRAM	-	-	-	-	-	-	-	-	-	-	-	-	-	-	8192	1,2,4,8,FP	1,2,4,8	FOUR BANK PAGE BURST	-	YES	-	-	-	-	22.22 mm	10.16 mm	-	-	-
W9825G6JH-6 888-535-W9825G6JH-6 Winbond RoHS : Package : - In Stock : 86400 1 : -
	Mfr. Part # W25Q80JVSSIQ Twicea Part # 888-535-W25Q80JVSSIQ	Winbond Electronics	IC FLASH 8M SPI 133MHZ 8SOIC Datasheet Compare	381 In Stock	Min.:1 Mult.:1	20 Weeks	-	Surface Mount	8-SOIC (0.209, 5.30mm Width)	YES	-	-	-	-	-	-	-	-	-	-	-	-	-	-	Non-Volatile	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-40°C~85°C TA	Tube	2013	SpiFlash®	-	-	Obsolete	3 (168 Hours)	8	-	-	-	-	-	-	-	-	-	2.7V~3.6V	DUAL	-	NOT SPECIFIED	1	3V	1.27mm	-	-	NOT SPECIFIED	-	S-PDSO-G8	-	-	3.6V	-	-	2.7V	-	8Mb 1M x 8	-	-	-	SYNCHRONOUS	133MHz	-	-	FLASH	SPI	-	1MX8	-	-	8	3ms	-	-	-	-	8388608 bit	-	SERIAL	-	-	-	-	3V	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	2.16mm	5.28mm	5.28mm	-	ROHS3 Compliant	-
W25Q80JVSSIQ 888-535-W25Q80JVSSIQ Winbond Electronics RoHS : Package : - In Stock : 381 1 : -
	Mfr. Part # W988D6FBGX7E Twicea Part # 888-535-W988D6FBGX7E	Winbond Electronics	DRAM Chip Mobile LPSDR SDRAM 256M-Bit 16Mx16 1.8V Datasheet Compare	20 In Stock	Min.:1 Mult.:1	10 Weeks	-	Surface Mount	54-TFBGA	YES	-	-	-	-	-	-	-	-	-	-	-	-	-	-	Volatile	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-25°C~85°C TC	Tray	2016	-	-	-	Active	3 (168 Hours)	54	EAR99	-	-	-	-	AUTO/SELF REFRESH	8542.32.00.24	-	-	1.7V~1.95V	BOTTOM	-	-	1	1.8V	0.8mm	-	-	-	54	R-PBGA-B54	Not Qualified	1.8V	1.95V	-	-	1.7V	-	256Mb 16M x 16	1	70mA	-	SYNCHRONOUS	133MHz	-	5.4ns	DRAM	Parallel	-	8MX32	3-STATE	-	32	15ns	15b	-	256 Mb	0.00001A	-	-	-	COMMON	-	-	-	-	-	-	-	-	-	16	-	-	-	-	-	-	-	8192	1248FP	1248	-	-	-	-	-	-	1.025mm	9mm	-	-	ROHS3 Compliant	Lead Free
W988D6FBGX7E 888-535-W988D6FBGX7E Winbond Electronics RoHS : Package : - In Stock : 20 1 : -
	Mfr. Part # W978H6KBVX2E Twicea Part # 888-535-W978H6KBVX2E	Winbond Electronics	IC SDRAM 256MBIT 400MHZ 134VFBGA Datasheet Compare	2280 In Stock	Min.:1 Mult.:1	10 Weeks	-	Surface Mount	134-VFBGA	YES	134	-	-	-	-	-	-	-	-	-	-	-	-	-	Volatile	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-25°C~85°C TC	Tray	2016	-	-	-	Active	3 (168 Hours)	134	-	-	-	-	-	AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM	-	-	-	1.14V~1.95V	BOTTOM	-	-	1	1.2V	0.65mm	-	-	-	-	-	-	-	1.3V	-	-	1.14V	-	256Mb 16M x 16	1	-	-	SYNCHRONOUS	400MHz	-	-	DRAM	Parallel	-	16MX16	-	-	16	15ns	-	-	-	-	268435456 bit	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	FOUR BANK PAGE BURST	-	-	-	-	-	1mm	11.5mm	10mm	-	ROHS3 Compliant	-
W978H6KBVX2E 888-535-W978H6KBVX2E Winbond Electronics RoHS : Package : - In Stock : 2280 1 : -
	Mfr. Part # W971GG6SB-18 Twicea Part # 888-535-W971GG6SB-18	Winbond Electronics	IC SDRAM 1GBIT 533MHZ 84BGA Datasheet Compare	1000 In Stock	Min.:1 Mult.:1	10 Weeks	-	Surface Mount	84-TFBGA	YES	-	-	-	-	-	-	-	-	-	-	-	-	-	-	Volatile	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	0°C~85°C TC	Tray	2011	-	-	-	Active	3 (168 Hours)	84	-	-	-	-	-	AUTO/SELF REFRESH	-	-	-	1.7V~1.9V	BOTTOM	-	-	1	1.8V	0.8mm	-	-	-	-	R-PBGA-B84	-	-	1.9V	-	-	1.7V	-	1Gb 64M x 16	1	-	-	SYNCHRONOUS	533MHz	-	350ps	DRAM	Parallel	-	64MX16	-	-	16	15ns	-	-	-	-	1073741824 bit	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1.2mm	12.5mm	8mm	-	ROHS3 Compliant	-
W971GG6SB-18 888-535-W971GG6SB-18 Winbond Electronics RoHS : Package : - In Stock : 1000 1 : -
	Mfr. Part # W25Q128JVEIM Twicea Part # 888-535-W25Q128JVEIM	Winbond Electronics	IC FLASH 128M SPI 133MHZ 8WSON Datasheet Compare	247 In Stock	Min.:1 Mult.:1	10 Weeks	-	Surface Mount	8-WDFN Exposed Pad	YES	-	-	-	-	-	-	-	-	-	-	-	-	-	-	Non-Volatile	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-40°C~85°C TA	Tube	-	SpiFlash®	-	yes	Active	3 (168 Hours)	8	-	-	-	-	-	IT ALSO OPERATES AT 104 MHZ CLOCK FREQUENCY AT 2.7 TO 3.0 V SUPPLY VOLTAGE	-	-	-	2.7V~3.6V	DUAL	-	NOT SPECIFIED	1	3.3V	1.27mm	-	-	NOT SPECIFIED	-	R-PDSO-N8	-	-	3.6V	-	-	3V	-	128Mb 16M x 8	-	-	-	SYNCHRONOUS	133MHz	-	-	FLASH	SPI - Quad I/O, QPI, DTR	-	16MX8	-	-	8	3ms	-	-	-	-	134217728 bit	-	SERIAL	-	-	-	-	3V	-	-	-	-	-	1	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	0.8mm	8mm	6mm	-	ROHS3 Compliant	-
W25Q128JVEIM 888-535-W25Q128JVEIM Winbond Electronics RoHS : Package : - In Stock : 247 1 : -
	Mfr. Part # W631GG6KB12I Twicea Part # 888-535-W631GG6KB12I	Winbond Electronics	DRAM Chip DDR3 SDRAM 1Gbit 64Mx16 1.5V 96-Pin WBGA Datasheet Compare	387 In Stock	Min.:1 Mult.:1	-	Surface Mount	Surface Mount	96-TFBGA	-	96	-	-	-	-	-	-	-	-	-	-	-	-	-	Volatile	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-40°C~95°C TC	Tray	-	-	-	-	Obsolete	3 (168 Hours)	96	EAR99	-	-	-	-	AUTO/SELF REFRESH	8542.32.00.32	-	-	1.425V~1.575V	BOTTOM	-	NOT SPECIFIED	1	1.5V	0.8mm	-	-	NOT SPECIFIED	96	-	Not Qualified	1.5V	1.575V	-	-	1.425V	-	1Gb 64M x 16	1	280mA	-	SYNCHRONOUS	800MHz	-	20ns	DRAM	Parallel	-	64MX16	3-STATE	-	16	-	16b	-	1 Gb	0.014A	-	1.6GHz	-	COMMON	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	8192	8	8	-	-	-	-	-	-	1.2mm	13mm	-	-	ROHS3 Compliant	-
W631GG6KB12I 888-535-W631GG6KB12I Winbond Electronics RoHS : Package : - In Stock : 387 1 : -
	Mfr. Part # W988D6FBGX6I Twicea Part # 888-535-W988D6FBGX6I	Winbond Electronics	DRAM Chip Mobile LPSDR SDRAM 256M-Bit 16Mx16 1.8V Datasheet Compare	1 In Stock	Min.:1 Mult.:1	10 Weeks	-	Surface Mount	54-TFBGA	YES	-	-	-	-	-	-	-	-	-	-	-	-	-	-	Volatile	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-40°C~85°C TA	Tray	2016	-	-	-	Active	3 (168 Hours)	54	EAR99	-	-	-	-	AUTO/SELF REFRESH	8542.32.00.24	-	-	1.7V~1.95V	BOTTOM	-	-	1	1.8V	0.8mm	-	-	-	54	R-PBGA-B54	Not Qualified	-	1.95V	1.8V	-	1.7V	-	256Mb 16M x 16	1	-	-	SYNCHRONOUS	166MHz	-	5.4ns	DRAM	Parallel	-	8MX32	3-STATE	-	32	15ns	-	-	-	0.00001A	268435456 bit	-	-	COMMON	-	-	-	-	-	-	-	-	-	16	-	-	-	-	-	-	-	8192	1248FP	1248	-	-	-	-	-	-	1.025mm	9mm	8mm	-	ROHS3 Compliant	-
W988D6FBGX6I 888-535-W988D6FBGX6I Winbond Electronics RoHS : Package : - In Stock : 1 1 : -
	Mfr. Part # W29N01GZDIBA Twicea Part # 888-535-W29N01GZDIBA	Winbond Electronics	IC FLASH 1G PARALLEL 48VFBGA Datasheet Compare	228 In Stock	Min.:1 Mult.:1	-	-	Surface Mount	48-VFBGA	YES	48	-	-	-	-	-	-	-	-	-	-	-	-	-	Non-Volatile	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-40°C~85°C TA	Tube	2016	-	-	-	Obsolete	3 (168 Hours)	48	-	-	-	-	-	-	-	-	-	1.7V~1.95V	BOTTOM	-	-	1	1.8V	0.8mm	-	-	-	-	-	-	-	1.95V	-	-	1.7V	-	1Gb 128M x 8	-	-	-	ASYNCHRONOUS	-	-	-	FLASH	Parallel	-	1GX1	-	-	1	35ns	-	-	-	-	1073741824 bit	-	-	-	-	-	-	1.8V	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1mm	8mm	6.5mm	-	ROHS3 Compliant	-
W29N01GZDIBA 888-535-W29N01GZDIBA Winbond Electronics RoHS : Package : - In Stock : 228 1 : -
	Mfr. Part # W9864G2GH-6 Twicea Part # 888-535-W9864G2GH-6	Winbond	DDR DRAM, 2MX32, 5ns, CMOS, PDSO86, 0.400 INCH, LEAD FREE, TSOP2-86 Datasheet Compare	1250 In Stock	Min.:1 Mult.:1	-	-	-	-	YES	-	-	86	5 ns	-	-	166 MHz	-	WINBOND ELECTRONICS CORP	-	Winbond Electronics Corp	W9864G2GH-6	-	-	-	-	-	-	3	-	2097152 words	2000000	70 °C	PLASTIC/EPOXY	TSSOP	TSSOP, TSSOP86,.46,20	TSSOP86,.46,20	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	Obsolete	TSOP2	-	40	8.4	Non-Compliant	Yes	-	-	3.3 V	-	-	-	-	-	-	Yes	-	-	-	EAR99	-	-	70 °C	0 °C	AUTO/SELF REFRESH	8542.32.00.02	DRAMs	CMOS	-	DUAL	GULL WING	260	1	-	0.5 mm	compliant	-	-	86	R-PDSO-G86	Not Qualified	3.3 V	3.6 V	3.3 V	COMMERCIAL	3 V	-	-	1	-	-	SYNCHRONOUS	-	0.14 mA	-	-	-	32 b	2MX32	3-STATE	1.2 mm	32	-	13 b	-	64 Mb	0.003 A	67108864 bit	166 MHz	-	COMMON	-	-	DDR DRAM	-	-	-	-	-	-	-	-	-	-	-	-	-	-	4096	1,2,4,8,FP	1,2,4,8	FOUR BANK PAGE BURST	-	YES	-	-	-	-	22.22 mm	10.16 mm	No	-	-
W9864G2GH-6 888-535-W9864G2GH-6 Winbond RoHS : Package : - In Stock : 1250 1 : -
	Mfr. Part # W25Q64FVZPIQ Twicea Part # 888-535-W25Q64FVZPIQ	Winbond Electronics	IC FLASH 64M SPI 104MHZ 8WSON Datasheet Compare	116 In Stock	Min.:1 Mult.:1	-	-	Surface Mount	8-WDFN Exposed Pad	YES	-	-	-	-	-	-	-	-	-	-	-	-	-	-	Non-Volatile	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-40°C~85°C TA	Tray	2016	SpiFlash®	-	-	Obsolete	3 (168 Hours)	8	-	-	-	-	-	-	-	-	-	2.7V~3.6V	DUAL	-	-	1	-	1.27mm	-	-	-	-	R-PDSO-N8	Not Qualified	-	3.6V	-	-	3V	-	64Mb 8M x 8	-	-	-	SYNCHRONOUS	104MHz	-	-	FLASH	SPI - Quad I/O, QPI	-	8MX8	3-STATE	-	8	50μs, 3ms	-	-	-	0.00005A	67108864 bit	-	SERIAL	-	-	-	-	-	SPI	-	-	20	HARDWARE/SOFTWARE	1	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	0.8mm	6mm	5mm	-	ROHS3 Compliant	-
W25Q64FVZPIQ 888-535-W25Q64FVZPIQ Winbond Electronics RoHS : Package : - In Stock : 116 1 : -
	Mfr. Part # W25M02GWTBIG TR Twicea Part # 888-535-W25M02GWTBIG TR	Winbond Electronics	IC FLASH 2GBIT SPI/QUAD 24TFBGA Datasheet Compare		Min.:1 Mult.:1	-	-	Surface Mount	24-TBGA	-	-	24-TFBGA (8x6)	-	-	W25M02	Winbond	-	2000	-	SPI	Winbond	-	104 MHz	+ 85 C	Non-Volatile	Winbond Electronics	- 40 C	Yes	-	SMD/SMT	-	-	-	-	-	-	-	-	-	-	-	Active	-	-	Details	-	1.95 V	1.7 V	1.70V - 1.95V	SpiStack	-40°C ~ 85°C (TA)	Reel	-	W25M02GW	-	-	-	-	-	-	QspiNAND Flash	-	-	-	-	-	Memory & Data Storage	-	1.7V ~ 1.95V	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	2Gbit	-	-	104MHz	-	104 MHz	-	8 ns	FLASH	SPI - Quad I/O	8 bit	High Quality Single Level Cell (SLC) Technology Standard Serial Interface with x1/x2/x4 Bus Width	-	-	-	700μs	-	Multichip Packages	-	-	2Gb	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	NAND-Based MCP	-	Multichip Packages	40ºC ~ 85ºC / -40ºC ~ 105ºC	256M x 8	-	-	-	-	-	-
W25M02GWTBIG TR 888-535-W25M02GWTBIG TR Winbond Electronics RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # W987D6HBGX7E Twicea Part # 888-535-W987D6HBGX7E	Winbond Electronics	DRAM Chip Mobile LPSDR SDRAM 128M-Bit 8Mx16 1.8V 54-Pin VFBGA Datasheet Compare	186 In Stock	Min.:1 Mult.:1	-	Surface Mount	Surface Mount	54-TFBGA	-	54	-	-	-	-	-	-	-	-	-	-	-	-	-	Volatile	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-25°C~85°C TC	Tray	2011	-	e1	-	Not For New Designs	3 (168 Hours)	54	-	-	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	AUTO/SELF REFRESH	-	-	-	1.7V~1.95V	BOTTOM	-	-	1	1.8V	0.8mm	-	-	-	-	-	-	1.8V	1.95V	-	-	1.7V	-	128Mb 8M x 16	1	70mA	-	-	133MHz	-	5.4ns	DRAM	Parallel	-	8MX16	3-STATE	-	16	15ns	14b	-	128 Mb	0.00001A	-	-	-	COMMON	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	4096	1248FP	1248	-	-	-	-	-	-	1.025mm	9mm	-	No	ROHS3 Compliant	-
W987D6HBGX7E 888-535-W987D6HBGX7E Winbond Electronics RoHS : Package : - In Stock : 186 1 : -
	Mfr. Part # W25Q32JVTBIQ Twicea Part # 888-535-W25Q32JVTBIQ	Winbond Electronics	IC FLASH 32M SPI 133MHZ 24TFBGA Datasheet Compare		Min.:1 Mult.:1	10 Weeks	-	Surface Mount	24-TBGA	YES	-	-	-	-	-	-	-	-	-	-	-	-	-	-	Non-Volatile	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-40°C~85°C TA	Tray	2016	SpiFlash®	e1	yes	Active	3 (168 Hours)	24	-	-	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	2.7V NOMINAL AVAILABLE WITH 104MHZ	-	-	-	2.7V~3.6V	BOTTOM	-	260	1	3.3V	1mm	-	-	NOT SPECIFIED	-	R-PBGA-B24	-	-	3.6V	-	-	3V	-	32Mb 4M x 8	-	-	-	SYNCHRONOUS	133MHz	-	-	FLASH	SPI - Quad I/O	-	4MX8	-	-	8	3ms	-	-	-	-	33554432 bit	-	SERIAL	-	-	-	-	3V	-	-	-	-	-	1	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1.2mm	8mm	6mm	-	ROHS3 Compliant	-
W25Q32JVTBIQ 888-535-W25Q32JVTBIQ Winbond Electronics RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # W25X80VSSIG Twicea Part # 888-535-W25X80VSSIG	Winbond Electronics	IC FLASH 8M SPI 75MHZ 8SOIC Datasheet Compare	356 In Stock	Min.:1 Mult.:1	-	-	Surface Mount	8-SOIC (0.209, 5.30mm Width)	YES	-	-	-	-	-	-	-	-	-	-	-	-	-	-	Non-Volatile	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-40°C~85°C TA	Tube	2006	SpiFlash®	e3	-	Obsolete	3 (168 Hours)	8	EAR99	-	MATTE TIN	-	-	SYNCHRONOUS MODE ALSO POSSIBLE	8542.32.00.51	-	-	2.7V~3.6V	DUAL	-	260	1	3V	1.27mm	unknown	-	40	8	S-PDSO-G8	Not Qualified	-	3.6V	3/3.3V	-	2.7V	SPI, Serial	8Mb 1M x 8	-	-	-	SYNCHRONOUS	75MHz	-	75 μs	FLASH	SPI	-	1MX8	-	-	8	3ms	-	-	-	0.00001A	8388608 bit	-	-	-	-	-	-	2.7V	SPI	100000 Write/Erase Cycles	-	20	HARDWARE/SOFTWARE	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	2.16mm	5.28mm	5.28mm	-	ROHS3 Compliant	Lead Free
W25X80VSSIG 888-535-W25X80VSSIG Winbond Electronics RoHS : Package : - In Stock : 356 1 : -
	Mfr. Part # W29N02GVBIAA Twicea Part # 888-535-W29N02GVBIAA	Winbond Electronics	IC FLASH 2G PARALLEL 63FBGA Datasheet Compare	50 In Stock	Min.:1 Mult.:1	10 Weeks	-	Surface Mount	63-VFBGA	YES	63	-	-	-	-	-	-	-	-	-	-	-	-	-	Non-Volatile	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-40°C~85°C TA	Tray	2015	-	-	-	Active	3 (168 Hours)	63	3A991.B.1.A	-	-	-	-	-	8542.32.00.51	-	-	2.7V~3.6V	BOTTOM	-	-	1	3.3V	0.8mm	-	-	-	-	-	-	-	3.6V	-	-	2.7V	-	2Gb 256M x 8	-	-	-	ASYNCHRONOUS	-	-	-	FLASH	Parallel	-	2GX1	-	-	1	25ns	-	-	-	-	2147483648 bit	-	-	-	-	-	-	3.3V	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1mm	11mm	9mm	-	ROHS3 Compliant	-
W29N02GVBIAA 888-535-W29N02GVBIAA Winbond Electronics RoHS : Package : - In Stock : 50 1 : -
	Mfr. Part # W29C020CP90B Twicea Part # 888-535-W29C020CP90B	Winbond Electronics	IC FLASH 2M PARALLEL 32PLCC Datasheet Compare	62 In Stock	Min.:1 Mult.:1	-	-	Surface Mount	32-LCC (J-Lead)	YES	-	-	-	-	-	-	-	-	-	-	-	-	-	-	Non-Volatile	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	0°C~70°C TA	Tube	2016	-	e0	-	Obsolete	1 (Unlimited)	32	EAR99	-	TIN LEAD	-	-	HARDWARE AND SOFTWARE DATA PROTECTION; 20-YEARS DATA RETENTION	8542.32.00.51	-	-	4.5V~5.5V	QUAD	-	NOT SPECIFIED	1	5V	1.27mm	unknown	90GHz	NOT SPECIFIED	32	R-PQCC-J32	Not Qualified	-	5.5V	5V	-	4.5V	-	2Mb 256K x 8	-	-	-	ASYNCHRONOUS	-	-	90ns	FLASH	Parallel	-	256KX8	-	-	8	10ms	-	-	-	0.0001A	2097152 bit	-	-	-	-	-	-	5V	-	10000 Write/Erase Cycles	10ms	-	-	-	YES	YES	NO	111	8K240K8K	-	BOTTOM/TOP	-	-	-	-	-	-	-	-	-	3.56mm	13.97mm	11.43mm	-	Non-RoHS Compliant	Contains Lead
W29C020CP90B 888-535-W29C020CP90B Winbond Electronics RoHS : Package : - In Stock : 62 1 : -

Integrated Circuits (ICs)

Memory definition: Memory is a component used to store programs and various data information. A memory cell is actually a type of sequential logic circuit. A m... Memory Product Listing: W25X10BVSNIG,W29N04GVSIAA,W25Q80BLSVIG,W9825G6JH-6,W25Q80JVSSIQ.Integrated Circuits (ICs) type:Embedded - Microcontrollers(134273),Memory(116337),PMIC - Voltage Regulators - Linear(107072),PMIC - Supervisors(101983),Embedded - FPGAs (Field Programmable Gate Array)(62862) .Memory has 3184 pieces of spot stock price information, you can click the "RFQ" button to confirm the inventory and price with the Twicea.

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