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W25M02GWTBIG TR Tech Specifications

Winbond  W25M02GWTBIG TR technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 24-TBGA
Supplier Device Package 24-TFBGA (8x6)
Mfr Winbond Electronics
Product Status Active
Memory Types Non-Volatile
Base Product Number W25M02
Supply Voltage-Nom (Vsup) 1.70V - 1.95V
Moisture Sensitive Yes
Maximum Clock Frequency 104 MHz
Maximum Operating Temperature + 85 C
Supply Voltage-Max 1.95 V
Minimum Operating Temperature - 40 C
Factory Pack QuantityFactory Pack Quantity 2000
Supply Voltage-Min 1.7 V
Mounting Styles SMD/SMT
Interface Type SPI
Manufacturer Winbond
Brand Winbond
Tradename SpiStack
RoHS Details
Operating Temperature -40°C ~ 85°C (TA)
Series W25M02GW
Packaging Reel
Type QspiNAND Flash
Subcategory Memory & Data Storage
Voltage - Supply 1.7V ~ 1.95V
Memory Size 2Gbit
Speed 104MHz
Clock Frequency 104 MHz
Access Time 8 ns
Memory Format FLASH
Memory Interface SPI - Quad I/O
Data Bus Width 8 bit
Organization High Quality Single Level Cell (SLC) Technology Standard Serial Interface with x1/x2/x4 Bus Width
Write Cycle Time - Word, Page 700μs
Product Type Multichip Packages
Memory Density 2Gb
Product NAND-Based MCP
Product Category Multichip Packages
Temperature 40ºC ~ 85ºC / -40ºC ~ 105ºC
Memory Organization 256M x 8
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