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W987D6HBGX7E Tech Specifications

Winbond  W987D6HBGX7E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mount Surface Mount
Mounting Type Surface Mount
Package / Case 54-TFBGA
Number of Pins 54Pins
Memory Types Volatile
Operating Temperature -25°C~85°C TC
Packaging Tray
Published 2011
JESD-609 Code e1
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 54Terminations
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature AUTO/SELF REFRESH
Voltage - Supply 1.7V~1.95V
Terminal Position BOTTOM
Number of Functions 1Function
Supply Voltage 1.8V
Terminal Pitch 0.8mm
Operating Supply Voltage 1.8V
Supply Voltage-Max (Vsup) 1.95V
Supply Voltage-Min (Vsup) 1.7V
Memory Size 128Mb 8M x 16
Number of Ports 1Port
Nominal Supply Current 70mA
Clock Frequency 133MHz
Access Time 5.4ns
Memory Format DRAM
Memory Interface Parallel
Organization 8MX16
Output Characteristics 3-STATE
Memory Width 16
Write Cycle Time - Word, Page 15ns
Address Bus Width 14b
Density 128 Mb
Standby Current-Max 0.00001A
I/O Type COMMON
Refresh Cycles 4096
Sequential Burst Length 1248FP
Interleaved Burst Length 1248
Length 9mm
Height Seated (Max) 1.025mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
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W987D6HBGX7E Documents

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