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W25Q32JVTBIQ Tech Specifications

Winbond  W25Q32JVTBIQ technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 24-TBGA
Surface Mount YES
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tray
Series SpiFlash®
Published 2016
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 24Terminations
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature 2.7V NOMINAL AVAILABLE WITH 104MHZ
Voltage - Supply 2.7V~3.6V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Supply Voltage 3.3V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B24
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 3V
Memory Size 32Mb 4M x 8
Operating Mode SYNCHRONOUS
Clock Frequency 133MHz
Memory Format FLASH
Memory Interface SPI - Quad I/O
Organization 4MX8
Memory Width 8
Write Cycle Time - Word, Page 3ms
Memory Density 33554432 bit
Parallel/Serial SERIAL
Programming Voltage 3V
Alternate Memory Width 1
Length 8mm
Height Seated (Max) 1.2mm
Width 6mm
RoHS Status ROHS3 Compliant
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W25Q32JVTBIQ Documents

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