Thermal - Heat Sinks Products For Sale - PDF - Fans, Thermal Management

Fans, Thermal Management
Thermal - Heat Sinks

						Factory Lead Time	Material	Shape	Package Cooled	Material Finish	Designed for	Factory Pack QuantityFactory Pack Quantity	Fin Style	For Use With/Related Products	Heatsink Material	Mfr	Mounting Styles	Package	Product Status	RoHS	Series	Part Status	Moisture Sensitivity Level (MSL)	Type	Color	Attachment Method	Height Off Base (Height of Fin)	Thermal Resistance @ Forced Air Flow	Accessory Type	Thermal Resistance @ Natural	Power Dissipation @ Temperature Rise	Product	Thermal Resistance	Diameter	Height	Length	Width	RoHS Status
	Mfr. HSE-B20254-035H Twicea 207-388-HSE-B20254-035H	CUI Devices	HEAT SINK, EXTRUSION, TO-220,25.	506	Min.:1 Mult.:1	11 Weeks	Aluminum Alloy	Rectangular, Fins	TO-220	Black Anodized	-	-	-	-	-	-	-	-	-	-	HSE	Active	Not Applicable	Board Level, Vertical	-	PC Pin	0.500 12.70mm	3.28°C/W @ 200 LFM	-	12.93°C/W	5.8W @ 75°C	-	-	-	-	1.000 25.40mm	1.375 34.93mm	RoHS Compliant
HSE-B20254-035H 207-388-HSE-B20254-035H CUI Devices : : - : 506 1 : -
	Mfr. HSS-B20-095H Twicea 207-388-HSS-B20-095H	CUI Devices	HEATSINK TO-220 4.1W ALUMINUM	753	Min.:1 Mult.:1	11 Weeks	Aluminum	Rectangular, Fins	TO-220	Black Anodized	-	-	-	-	-	-	-	-	-	-	HSS	Active	Not Applicable	Board Level, Vertical	-	PC Pin	0.626 15.90mm	6.50°C/W @ 200 LFM	-	18.34°C/W	4.1W @ 75°C	-	-	-	-	0.441 11.20mm	0.866 22.00mm	RoHS Compliant
HSS-B20-095H 207-388-HSS-B20-095H CUI Devices : : - : 753 1 : -
	Mfr. HSE-B18317-035H-01 Twicea 207-388-HSE-B18317-035H-01	CUI Devices	HEAT SINK, EXTRUSION, TO-218, 31	17	Min.:1 Mult.:1	11 Weeks	Aluminum Alloy	Rectangular, Fins	TO-218	Black Anodized	-	-	-	-	-	-	-	-	-	-	HSE	Active	Not Applicable	Board Level, Vertical	-	PC Pin	0.984 25.00mm	4.33°C/W @ 200 LFM	-	7.50°C/W	10.0W @ 75°C	-	-	-	-	1.250 31.75mm	1.638 41.60mm	RoHS Compliant
HSE-B18317-035H-01 207-388-HSE-B18317-035H-01 CUI Devices : : - : 17 1 : -
	Mfr. HSE-B20254-035H-01 Twicea 207-388-HSE-B20254-035H-01	CUI Devices	HEAT SINK, EXTRUSION, TO-220, 25	3811	Min.:1 Mult.:1	11 Weeks	Aluminum Alloy	Rectangular, Fins	TO-220	Black Anodized	-	-	-	-	-	-	-	-	-	-	HSE	Active	Not Applicable	Board Level, Vertical	-	PC Pin	0.500 12.70mm	4.42°C/W @ 200 LFM	-	14.42°C/W	5.2W @ 75°C	-	-	-	-	1.000 25.40mm	1.378 35.00mm	RoHS Compliant
HSE-B20254-035H-01 207-388-HSE-B20254-035H-01 CUI Devices : : - : 3811 1 : -
	Mfr. HSB30-373710 Twicea 207-388-HSB30-373710	CUI Devices	Heat Sinks heat sink, BGA, 37.4 x 37 x 10 mm, push pins	993	Min.:1 Mult.:1	-	-	-	-	-	BGA	-	Vertical Fin	-	Aluminum	CUI Devices	Adhesive	Box	Active	Details	HSB	-	-	Component	Black	-	-	-	-	-	-	Heatsinks	13.8 C/W	-	10 mm	37.4 mm	37.4 mm	-
HSB30-373710 207-388-HSB30-373710 CUI Devices : : - : 993 1 : -
	Mfr. HSS26-B20-P38 Twicea 207-388-HSS26-B20-P38	CUI Devices	Heat Sinks heat sink, stamping, TO-218/TO-220, 50.8 x 35 x 8.5 mm, solder pin	3537	Min.:1 Mult.:1	-	Aluminum Alloy	Rectangular, Fins	TO-218, TO-220	Black Anodized	TO-220	-	Extruded Axial Fin	-	Aluminum	CUI Devices	PCB	Bag	Active	Details	HSS	-	-	Stamped Heatsink	Black	Bolt On and PC Pin	-	9.20°C/W @ 200 LFM	-	16.66°C/W	4.5W @ 75°C	Heatsinks	19.8 C/W	-	8.5 mm	50.8 mm	35 mm	-
HSS26-B20-P38 207-388-HSS26-B20-P38 CUI Devices : : - : 3537 1 : -
	Mfr. HSS09-B20-P431 Twicea 207-388-HSS09-B20-P431	CUI Devices	Heat Sinks heat sink, stamping, TO-220, 29.97 x 25.	2220	Min.:1 Mult.:1	-	Aluminum Alloy	Rectangular	TO-220	Black Anodized	TO-220	3000	Formed Fin	-	Aluminum Alloy	CUI Devices	PCB Mount	Box	Active	-	HSS	-	-	Board Level, Vertical	Black	Bolt On and PC Pin	-	7.70°C/W @ 200 LFM	-	18.82°C/W	4.0W @ 75°C	Heatsinks	22.9 C/W	-	12.7 mm	29.97 mm	25.4 mm	-
HSS09-B20-P431 207-388-HSS09-B20-P431 CUI Devices : : - : 2220 1 : -
	Mfr. HSB10-232306 Twicea 207-388-HSB10-232306	CUI Devices	Heat Sinks heat sink, BGA, 23 x 23 x 6 mm	318	Min.:1 Mult.:1	-	Aluminum Alloy	Square, Pin Fins	BGA	Black Anodized	BGA	1872	Vertical Fin	-	Aluminum Alloy	CUI Devices	Adhesive	Box	Active	-	HSB	-	-	Top Mount	Black	Adhesive	-	9.60°C/W @ 200 LFM	-	25.46°C/W	3.0W @ 75°C	Heatsinks	29.2 C/W	-	6 mm	23 mm	23 mm	-
HSB10-232306 207-388-HSB10-232306 CUI Devices : : - : 318 1 : -
	Mfr. HSS14-B20-NP Twicea 207-388-HSS14-B20-NP	CUI Devices	Heat Sinks heat sink, stamping, TO-220, 19.05 x 24.	4975	Min.:1 Mult.:1	-	Aluminum Alloy	Rectangular	TO-220	Black Anodized	TO-220	5000	Formed Fin	-	Aluminum Alloy	CUI Devices	PCB Mount	Box	Active	-	HSS	-	-	Board Level, Vertical	Black	-	-	11.60°C/W @ 200 LFM	-	23.91°C/W	3.1W @ 75°C	Heatsinks	28.6 C/W	-	11.2 mm	24.9 mm	19.05 mm	-
HSS14-B20-NP 207-388-HSS14-B20-NP CUI Devices : : - : 4975 1 : -
	Mfr. HSB19-272718 Twicea 207-388-HSB19-272718	CUI Devices	Heat Sinks heat sink, BGA, 27 x 27 x 18 mm	114	Min.:1 Mult.:1	-	Aluminum Alloy	Square, Pin Fins	BGA	Black Anodized	BGA	1320	Vertical Fin	-	Aluminum Alloy	CUI Devices	Adhesive	Box	Active	-	HSB	-	-	Top Mount	Black	Adhesive	-	4.50°C/W @ 200 LFM	-	11.11°C/W	6.8W @ 75°C	Heatsinks	14.7 C/W	-	18 mm	27 mm	27 mm	-
HSB19-272718 207-388-HSB19-272718 CUI Devices : : - : 114 1 : -
	Mfr. HSB09-212115 Twicea 207-388-HSB09-212115	CUI Devices	Heat Sinks heat sink, BGA, 21 x 21 x 15 mm	2631	Min.:1 Mult.:1	-	Aluminum Alloy	Square, Pin Fins	BGA	Black Anodized	BGA	1152	Vertical Fin	-	Aluminum Alloy	CUI Devices	Adhesive	Box	Active	-	HSB	-	-	Top Mount	Black	Adhesive	-	6.00°C/W @ 200 LFM	-	17.39°C/W	4.3W @ 75°C	Heatsinks	23 C/W	-	15 mm	21 mm	21 mm	-
HSB09-212115 207-388-HSB09-212115 CUI Devices : : - : 2631 1 : -
	Mfr. HSB05-171711 Twicea 207-388-HSB05-171711	CUI Devices	Heat Sinks heat sink, BGA, 17 x 17 x 11.5 mm	818	Min.:1 Mult.:1	-	Aluminum Alloy	Square, Pin Fins	BGA	Black Anodized	BGA	1960	Vertical Fin	-	Aluminum Alloy	CUI Devices	Adhesive	Box	Active	-	HSB	-	-	Top Mount	Black	Adhesive	-	8.40°C/W @ 200 LFM	-	23.91°C/W	3.1W @ 75°C	Heatsinks	29.1 C/W	-	11.5 mm	17 mm	17 mm	-
HSB05-171711 207-388-HSB05-171711 CUI Devices : : - : 818 1 : -
	Mfr. HSB01-080808 Twicea 207-388-HSB01-080808	CUI Devices	Heat Sinks heat sink, BGA, 8.5 x 8.5 x 8 mm	255	Min.:1 Mult.:1	-	Aluminum Alloy	Square, Pin Fins	BGA	Black Anodized	BGA	3672	Vertical Fin	-	Aluminum Alloy	CUI Devices	Adhesive	Box	Active	-	HSB	-	-	Top Mount	Black	Adhesive	-	16.00°C/W @ 200 LFM	-	39.10°C/W	1.9W @ 75°C	Heatsinks	43.3 C/W	-	8 mm	8.5 mm	8.5 mm	-
HSB01-080808 207-388-HSB01-080808 CUI Devices : : - : 255 1 : -
	Mfr. HSB18-232310 Twicea 207-388-HSB18-232310	CUI Devices	Heat Sinks heat sink, BGA, 23 x 23 x 10 mm	3578	Min.:1 Mult.:1	-	Aluminum Alloy	Square, Pin Fins	BGA	Black Anodized	BGA	1872	Vertical Fin	-	Aluminum Alloy	CUI Devices	Adhesive	Box	Active	-	HSB	-	-	Top Mount	Black	Adhesive	-	6.80°C/W @ 200 LFM	-	20.41°C/W	3.7W @ 75°C	Heatsinks	24 C/W	-	10 mm	23 mm	23 mm	-
HSB18-232310 207-388-HSB18-232310 CUI Devices : : - : 3578 1 : -
	Mfr. HSB11-252518 Twicea 207-388-HSB11-252518	CUI Devices	Heat Sinks heat sink, BGA, 25 x 25 x 18 mm	1868	Min.:1 Mult.:1	-	Aluminum Alloy	Square, Pin Fins	BGA	Black Anodized	BGA	1408	Vertical Fin	-	Aluminum Alloy	CUI Devices	Adhesive	Box	Active	-	HSB	-	-	Top Mount	Black	Adhesive	-	4.50°C/W @ 200 LFM	-	13.70°C/W	5.5W @ 75°C	Heatsinks	16.8 C/W	-	18 mm	25 mm	25 mm	-
HSB11-252518 207-388-HSB11-252518 CUI Devices : : - : 1868 1 : -
	Mfr. HSB20-353525 Twicea 207-388-HSB20-353525	CUI Devices	HEAT SINK, BGA, 35 X 35 X 25 MM	499	Min.:1 Mult.:1	-	Aluminum Alloy	Square, Pin Fins	BGA	Black Anodized	BGA	-	Vertical Fin	-	Aluminum Alloy	CUI Devices	Adhesive	Box	Active	-	HSB	-	-	Top Mount	-	Adhesive	-	2.70°C/W @ 200 LFM	-	6.65°C/W	11.3W @ 75°C	Heat Sinks	9.9 C/W	-	25 mm	1.378 (35.00mm)	1.378 (35.00mm)	-
HSB20-353525 207-388-HSB20-353525 CUI Devices : : - : 499 1 : -
	Mfr. HSC-06 Twicea 207-388-HSC-06	CUI Devices	Heat Sinks Heat sink clip for H SS08-B18-CP	271	Min.:1 Mult.:1	-	-	-	-	-	-	1000	-	HSS08-B18-CP	-	CUI Devices	-	Box	Active	-	HSC	-	-	Clip	-	-	-	-	Heat Sink Clip	-	-	Accessories	-	-	12.38 mm	30.8 mm	6.5 mm	-
HSC-06 207-388-HSC-06 CUI Devices : : - : 271 1 : -
	Mfr. HSS01-B20-CP Twicea 207-388-HSS01-B20-CP	CUI Devices	Heat Sinks heat sink, stamping, TO-220, 49.31 x 48.	577	Min.:1 Mult.:1	-	Aluminum Alloy	Rectangular	TO-220	Black Anodized	TO-220	500	Formed Fin	-	Aluminum Alloy	CUI Devices	PCB Mount	Box	Active	-	HSS	-	-	Board Level, Vertical	Black	Bolt On and PC Pin	-	3.70°C/W @ 200 LFM	-	7.59°C/W	9.9W @ 75°C	Heatsinks	10.6 C/W	-	24.13 mm	49.31 mm	48.26 mm	-
HSS01-B20-CP 207-388-HSS01-B20-CP CUI Devices : : - : 577 1 : -
	Mfr. HSB03-121218 Twicea 207-388-HSB03-121218	CUI Devices	Heat Sinks heat sink, BGA, 12 x 12 x 18 mm	54	Min.:1 Mult.:1	-	Aluminum Alloy	Square, Pin Fins	BGA	Black Anodized	BGA	2520	Vertical Fin	-	Aluminum Alloy	CUI Devices	Adhesive	Box	Active	-	HSB	-	-	Top Mount	Black	Adhesive	-	9.60°C/W @ 200 LFM	-	24.01°C/W	3.1W @ 75°C	Heatsinks	28.8 C/W	-	18 mm	12 mm	12 mm	-
HSB03-121218 207-388-HSB03-121218 CUI Devices : : - : 54 1 : -
	Mfr. HSB17-404025 Twicea 207-388-HSB17-404025	CUI Devices	Heat Sinks heat sink, BGA, 40 x 40 x 25 mm	191	Min.:1 Mult.:1	-	Aluminum Alloy	Square, Pin Fins	BGA	Black Anodized	BGA	1280	Vertical Fin	-	Aluminum Alloy	CUI Devices	Adhesive	Box	Active	-	HSB	-	-	Top Mount	Black	Adhesive	-	2.10°C/W @ 200 LFM	-	6.41°C/W	11.7W @ 75°C	Heatsinks	9 C/W	-	25 mm	40 mm	40 mm	-
HSB17-404025 207-388-HSB17-404025 CUI Devices : : - : 191 1 : -

Fans, Thermal Management

Thermal - Heat Sinks definition: A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical ... Thermal - Heat Sinks Product Listing: HSE-B20254-035H,HSS-B20-095H,HSE-B18317-035H-01,HSE-B20254-035H-01,HSB30-373710.Fans, Thermal Management type:Thermal - Heat Sinks(119066),DC Brushless Fans (BLDC)(31200),Thermal - Pads, Sheets(15490),AC Fans(6243),Thermal - Accessories(5231) .Thermal - Heat Sinks has 196 pieces of spot stock price information, you can click the "RFQ" button to confirm the inventory and price with the Twicea.

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Fans, Thermal Management