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HSB11-252518

CUI Devices  HSB11-252518 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Material Aluminum Alloy
Shape Square, Pin Fins
Package Cooled BGA
Material Finish Black Anodized
Designed for BGA
Mounting Styles Adhesive
Heatsink Material Aluminum Alloy
Fin Style Vertical Fin
Factory Pack QuantityFactory Pack Quantity 1408
Package Box
Mfr CUI Devices
Product Status Active
Series HSB
Type Top Mount
Color Black
Attachment Method Adhesive
Thermal Resistance @ Forced Air Flow 4.50°C/W @ 200 LFM
Thermal Resistance @ Natural 13.70°C/W
Power Dissipation @ Temperature Rise 5.5W @ 75°C
Product Heatsinks
Thermal Resistance 16.8 C/W
Length 25 mm
Width 25 mm
Height 18 mm
Diameter -
HSB11-252518 brand manufacturers: CUI Devices, Twicea stock, HSB11-252518 reference price.CUI Devices. HSB11-252518 parameters, HSB11-252518 Datasheet PDF and pin diagram description download.You can use the HSB11-252518 Thermal - Heat Sinks, DSP Datesheet PDF, find HSB11-252518 pin diagram and circuit diagram and usage method of function,HSB11-252518 electronics tutorials.You can download from the Twicea.