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HSB19-272718

CUI Devices  HSB19-272718 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Material Aluminum Alloy
Shape Square, Pin Fins
Package Cooled BGA
Material Finish Black Anodized
Designed for BGA
Mounting Styles Adhesive
Heatsink Material Aluminum Alloy
Fin Style Vertical Fin
Factory Pack QuantityFactory Pack Quantity 1320
Package Box
Mfr CUI Devices
Product Status Active
Series HSB
Type Top Mount
Color Black
Attachment Method Adhesive
Thermal Resistance @ Forced Air Flow 4.50°C/W @ 200 LFM
Thermal Resistance @ Natural 11.11°C/W
Power Dissipation @ Temperature Rise 6.8W @ 75°C
Product Heatsinks
Thermal Resistance 14.7 C/W
Length 27 mm
Width 27 mm
Height 18 mm
Diameter -
HSB19-272718 brand manufacturers: CUI Devices, Twicea stock, HSB19-272718 reference price.CUI Devices. HSB19-272718 parameters, HSB19-272718 Datasheet PDF and pin diagram description download.You can use the HSB19-272718 Thermal - Heat Sinks, DSP Datesheet PDF, find HSB19-272718 pin diagram and circuit diagram and usage method of function,HSB19-272718 electronics tutorials.You can download from the Twicea.