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| Image | Part # | Manufacturer | Description | Availability | Pricing | Quantity | Surface Mount | Number of Terminals | Ihs Manufacturer | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | JESD-609 Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Organization | Seated Height-Max | Memory Width | Memory Density | Memory IC Type | Length | Width |
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![]() | Mfr. Part #MC-242453F9-B10-BT3Twicea Part #4095-633-MC-242453F9-B10-BT3 | NEC Electronics Group |
Memory Circuit, 2MX16, CMOS, PBGA77, 12 X 7 MM, FBGA-77
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| Min.:1 Mult.:1 | YES | 77 | NEC ELECTRONICS CORP | 2097152 words | 2000000 | 70 °C | -20 °C | PLASTIC/EPOXY | TFBGA | TFBGA, | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | - | - | EAR99 | - | THE DEVICE ALSO CONTAINS A 1M X 16 MOBILE SPECIFIED RAM | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 77 | R-PBGA-B77 | Not Qualified | 3 V | COMMERCIAL | 2.6 V | ASYNCHRONOUS | 2MX16 | 1.2 mm | 16 | 33554432 bit | MEMORY CIRCUIT | 12 mm | 7 mm | ||
| MC-242453F9-B10-BT3 | |||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #UPD41101C-2Twicea Part #4095-633-UPD41101C-2 | NEC Electronics Group |
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| Min.:1 Mult.:1 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
| UPD41101C-2 | |||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #MC-222253AF9-B85X-BT3Twicea Part #4095-633-MC-222253AF9-B85X-BT3 | NEC Electronics America Inc |
Description: Memory Circuit, 2MX16, MOS, PBGA77, 12 X 7 MM, FBGA-77
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 77 | NEC ELECTRONICS AMERICA INC | 2097152 words | 2000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | 12 X 7 MM, FBGA-77 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | - | No | e0 | EAR99 | TIN LEAD | SRAM IS ORGANISED AS 256 X 16 OR 512K X 8 AND FLASH CAN ALSO BE ORGANISED AS 4M X 8 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | compliant | - | R-PBGA-B77 | Not Qualified | 3.6 V | OTHER | 2.7 V | ASYNCHRONOUS | 2MX16 | 1.2 mm | 16 | 33554432 bit | MEMORY CIRCUIT | 12 mm | 7 mm | ||
| MC-222253AF9-B85X-BT3 |
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