MC-222253AF9-B85X-BT3 Tech Specifications

NEC  MC-222253AF9-B85X-BT3 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 77Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer NEC ELECTRONICS AMERICA INC
Package Description 12 X 7 MM, FBGA-77
Number of Words 2097152 wordsWord
Number of Words Code 2000000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -25 °C
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
JESD-609 Code e0
ECCN Code EAR99
Terminal Finish TIN LEAD
Additional Feature SRAM IS ORGANISED AS 256 X 16 OR 512K X 8 AND FLASH CAN ALSO BE ORGANISED AS 4M X 8
HTS Code 8542.32.00.71
Terminal Position BOTTOM
Terminal Form BALL
Number of Functions 1Function
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
JESD-30 Code R-PBGA-B77
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6 V
Temperature Grade OTHER
Supply Voltage-Min (Vsup) 2.7 V
Operating Mode ASYNCHRONOUS
Organization 2MX16
Seated Height-Max 1.2 mm
Memory Width 16
Memory Density 33554432 bit
Memory IC Type MEMORY CIRCUIT
Length 12 mm
Width 7 mm
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MC-222253AF9-B85X-BT3 Documents

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