- Networking Solutions
- Serial Device Servers
| Surface Mount | Number of Terminals | Ihs Manufacturer | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Supply Current-Max | Seated Height-Max | Telecom IC Type | Length | Width | |||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
  | Mfr.KS8804BTwicea700-644-KS8804B | Samsung Semiconductor |
Support Circuit, CMOS, PDSO16,
| Min.:1 Mult.:1 | YES | 16 | SAMSUNG SEMICONDUCTOR INC | 75 °C | -30 °C | PLASTIC/EPOXY | SOP | SOP, DIP16,.3 | DIP16,.3 | RECTANGULAR | SMALL OUTLINE | Obsolete | - | No | 5 V | e0 | No | TIN LEAD | 8542.39.00.01 | DUAL | GULL WING | 1 | 2.54 mm | compliant | - | R-PDSO-G16 | Not Qualified | COMMERCIAL EXTENDED | 0.007 mA | - | CORDLESS TELEPHONE SUPPORT CIRCUIT | - | - | ||
| KS8804B | |||||||||||||||||||||||||||||||||||||||
 | Mfr.S1A0429A01-S0BATwicea700-644-S1A0429A01-S0BA | Samsung Semiconductor |
RF and Baseband Circuit, PDSO16, 0.225 INCH, SOP-16
| Min.:1 Mult.:1 | YES | 16 | SAMSUNG SEMICONDUCTOR INC | 70 °C | -10 °C | PLASTIC/EPOXY | SOP | SOP, SOP16,.25 | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | - | 3 V | - | - | - | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | compliant | 16 | R-PDSO-G16 | Not Qualified | COMMERCIAL | 0.008 mA | 1.95 mm | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | 9.9 mm | 3.95 mm | ||
| S1A0429A01-S0BA | |||||||||||||||||||||||||||||||||||||||
 | Mfr.KA8510QTwicea700-644-KA8510Q | Samsung Semiconductor |
RF and Baseband Circuit, PQFP64, 14 X 20 MM, QFP-64
| Min.:1 Mult.:1 | YES | 64 | SAMSUNG SEMICONDUCTOR INC | 75 °C | -25 °C | PLASTIC/EPOXY | QFP | QFP, QFP64(UNSPEC) | QFP64(UNSPEC) | RECTANGULAR | FLATPACK | Obsolete | QFP | No | 3 V | e0 | No | TIN LEAD | 8542.39.00.01 | QUAD | GULL WING | 1 | 1 mm | compliant | 64 | R-PQFP-G64 | Not Qualified | COMMERCIAL EXTENDED | - | 3 mm | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | 20 mm | 14 mm | ||
| KA8510Q |
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