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XKTF-1307-18 Tech Specifications

XKB Connectivity  XKTF-1307-18 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Weight 0.628
Overall Dimension W13.4XD13.6XH1.8
Height from mounting surface (mm) 1.8
Soldering Temp (Max) 260°C
Name #REF!
Contact Materials Copper alloys
Conntact Coatings Gold plated
Package Specifications SMD
Maximum Self Height 1.8mm
Connecting Mode Flip-lid type
Part Status Active
Pin Count 8
Card Type MicroSD卡(TF卡)
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