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XKSIM-008 Tech Specifications
XKB Connectivity XKSIM-008 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Weight | 1.3 | |
| Overall Dimension | W24.6XD17.6XH1.8 | |
| Height from mounting surface (mm) | 1.8 | |
| Soldering Temp (Max) | 260°C | |
| Name | #REF! | |
| Contact Materials | Copper alloys | |
| Conntact Coatings | Gold plated | |
| Package Specifications | SMD | |
| Maximum Self Height | 1.8mm | |
| Connecting Mode | Flip-lid type | |
| Part Status | Active | |
| Pin Count | 6 | |
| Card Type | NanoSIM卡 |
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