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XC17S50APDG8C

Xilinx  XC17S50APDG8C technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Through Hole
Package / Case 8-DIP (0.300, 7.62mm)
Surface Mount NO
Number of Pins 8Pins
Operating Temperature 0°C~70°C
Packaging Tube
Published 1999
JESD-609 Code e3
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8Terminations
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Voltage - Supply 3V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) 250
Number of Functions 1Function
Supply Voltage 3.3V
Terminal Pitch 2.54mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC17S50A
Pin Count 8
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 3V
Programmable Type OTP
Memory Size 500kb
Organization 559200X1
Output Characteristics 3-STATE
Memory Width 1
Density 1 Mb
Standby Current-Max 0.001A
Parallel/Serial SERIAL
I/O Type COMMON
Memory IC Type CONFIGURATION MEMORY
Length 9.3599mm
Height Seated (Max) 4.5974mm
Width 7.62mm
Radiation Hardening No
RoHS Status RoHS Compliant

XC17S50APDG8C

Download datasheets and manufacturer documentation for   XC17S50APDG8C

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