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XAZU2EG-1SFVA625Q Tech Specifications

Xilinx  XAZU2EG-1SFVA625Q technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 11 Weeks
Package / Case 625-BFBGA, FCBGA
Surface Mount YES
Number of I/Os 128I/Os
Operating Temperature -40°C~125°C TJ
Packaging Tray
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 625Terminations
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.85V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B625
Speed 500MHz, 1.2GHz
RAM Size 1.2MB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, I2C, SPI, UART/USART, USB
Architecture MPU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Length 21mm
Height Seated (Max) 3.43mm
Width 21mm
RoHS Status ROHS3 Compliant
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XAZU2EG-1SFVA625Q Documents

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