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XC1736EPD8C Tech Specifications

Xilinx  XC1736EPD8C technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount NO
Number of Terminals 8Terminals
Package Description PLASTIC, DIP-8
Package Style IN-LINE
Moisture Sensitivity Levels 1
Number of Words Code 36288Words Codes
Package Body Material PLASTIC/EPOXY
Package Equivalence Code DIP8,.3
Reflow Temperature-Max (s) 30
Operating Temperature-Max 70 °C
Rohs Code No
Manufacturer Part Number XC1736EPD8C
Clock Frequency-Max (fCLK) 10 MHz
Number of Words 36288 wordsWord
Supply Voltage-Nom (Vsup) 5 V
Package Code DIP
Package Shape RECTANGULAR
Manufacturer Xilinx
Part Life Cycle Code Obsolete
Ihs Manufacturer XILINX INC
Risk Rank 8.7
Part Package Code DIP
JESD-609 Code e0
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn85Pb15)
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
HTS Code 8542.32.00.61
Subcategory OTP ROMs
Technology CMOS
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Peak Reflow Temperature (Cel) 225
Number of Functions 1Function
Terminal Pitch 2.54 mm
Reach Compliance Code not_compliant
Pin Count 8
JESD-30 Code R-PDIP-T8
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.25 V
Power Supplies 5 V
Temperature Grade COMMERCIAL
Supply Voltage-Min (Vsup) 4.75 V
Operating Mode SYNCHRONOUS
Supply Current-Max 0.01 mA
Organization 36288X1
Output Characteristics 3-STATE
Seated Height-Max 4.5974 mm
Memory Width 1
Standby Current-Max 0.00005 A
Memory Density 36288 bit
Parallel/Serial SERIAL
I/O Type COMMON
Memory IC Type CONFIGURATION MEMORY
Width 7.62 mm
Length 9.3599 mm
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