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W949D6CBHX6E

Winbond  W949D6CBHX6E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 60Terminals
Package Description 8 X 9 MM, 0.80 MM PITCH, HALOGEN FREE AND LEAD FREE, VFBGA-60
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Number of Words Code 32000000Words Codes
Package Body Material PLASTIC/EPOXY
Package Equivalence Code BGA60,9X10,32
Operating Temperature-Min -25 °C
Reflow Temperature-Max (s) NOT SPECIFIED
Access Time-Max 5 ns
Operating Temperature-Max 85 °C
Rohs Code Yes
Manufacturer Part Number W949D6CBHX6E
Clock Frequency-Max (fCLK) 166 MHz
Number of Words 33554432 wordsWord
Supply Voltage-Nom (Vsup) 1.8 V
Package Code TFBGA
Package Shape RECTANGULAR
Manufacturer Winbond Electronics Corp
Part Life Cycle Code Active
Ihs Manufacturer WINBOND ELECTRONICS CORP
Risk Rank 5.37
Part Package Code BGA
ECCN Code EAR99
Additional Feature AUTO/SELF REFRESH
HTS Code 8542.32.00.28
Subcategory DRAMs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
Pin Count 60
JESD-30 Code R-PBGA-B60
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.95 V
Power Supplies 1.8 V
Temperature Grade OTHER
Supply Voltage-Min (Vsup) 1.7 V
Number of Ports 1Port
Operating Mode SYNCHRONOUS
Supply Current-Max 0.075 mA
Organization 32MX16
Output Characteristics 3-STATE
Seated Height-Max 1.025 mm
Memory Width 16
Standby Current-Max 0.00001 A
Memory Density 536870912 bit
I/O Type COMMON
Memory IC Type DDR DRAM
Refresh Cycles 8192
Sequential Burst Length 2,4,8,16
Interleaved Burst Length 2,4,8,16
Access Mode FOUR BANK PAGE BURST
Self Refresh YES
Width 8 mm
Length 9 mm
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