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W29N04GZSIBA/TRAY Tech Specifications

Winbond  W29N04GZSIBA/TRAY technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

EU RoHS Compliant
ECCN (US) 3A991.b.1.a
Automotive Yes
PPAP Unknown
Cell Type NAND
Chip Density (bit) 4G
Address Bus Width (bit) 30
Number of Bits/Word (bit) 8Bits/Word (bit)s
Number of Words 512MWord
Programmability Yes
Maximum Erase Time (S) 0.01/Block
Maximum Programming Time (ms) 0.7/Page
Interface Type Parallel
Minimum Operating Supply Voltage (V) 1.7
Typical Operating Supply Voltage (V) 1.8
Maximum Operating Supply Voltage (V) 1.95
Operating Current (mA) 20
Program Current (mA) 20
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Command Compatible No
ECC Support Yes
Support of Page Mode No
Minimum Endurance (Cycles) 100000
Part Status Active
Page Size 2Kbyte
Boot Block No
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