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W29GL128CH9B/REEL Tech Specifications

Winbond  W29GL128CH9B/REEL technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

EU RoHS Compliant
ECCN (US) 3A991.b.1.a
Automotive No
PPAP No
Cell Type NOR
Chip Density (bit) 128M
Block Organization Symmetrical
Location of Boot Block Bottom|Top
Address Bus Width (bit) 23
Number of Bits/Word (bit) 1
Number of Words 128MWord
Programmability Yes
Timing Type Asynchronous
Max. Access Time (ns) 100
Maximum Erase Time (S) 256/Chip
Maximum Page Access Time (ns) 35
Maximum Programming Time (ms) 224000/Chip
OE Access Time (ns) 35
Interface Type Parallel
Minimum Operating Supply Voltage (V) 2.7
Typical Operating Supply Voltage (V) 3|3.3
Maximum Operating Supply Voltage (V) 3.6
Programming Voltage (V) 2.7 to 3.6
Operating Current (mA) 55
Page Read Current (mA) 25
Program Current (mA) 30
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Command Compatible Yes
ECC Support No
Support of Page Mode Yes
Mounting Surface Mount
Package Height 0.6(Min)
Package Width 11
Package Length 13
PCB changed 48
Standard Package Name BGA
Supplier Package LFBGA
Lead Shape Ball
Part Status Obsolete
Pin Count 48
Architecture Sectored
Sector Size 128Kbyte x 128
Page Size 256byte
Boot Block Yes
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