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W29GL064CB7S/REEL Tech Specifications

Winbond  W29GL064CB7S/REEL technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

EU RoHS Compliant
ECCN (US) 3A991.b.1.a
Cell Type NOR
Chip Density (bit) 64M
Block Organization Symmetrical
Location of Boot Block Bottom
Address Bus Width (bit) 22
Number of Bits/Word (bit) 8/16
Number of Words 8M/4MWord
Programmability Yes
Timing Type Asynchronous
Max. Access Time (ns) 70
Maximum Erase Time (S) 128/Chip
Maximum Page Access Time (ns) 35
Maximum Programming Time (ms) 112000/Chip
OE Access Time (ns) 35
Interface Type Parallel
Minimum Operating Supply Voltage (V) 2.7
Typical Operating Supply Voltage (V) 3|3.3
Maximum Operating Supply Voltage (V) 3.6
Programming Voltage (V) 2.7 to 3.6
Operating Current (mA) 55
Page Read Current (mA) 25
Program Current (mA) 30
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Command Compatible Yes
ECC Support No
Support of Page Mode Yes
Part Status Obsolete
Architecture Sectored
Sector Size 64Kbyte x 128
Page Size 8Words/16byte
Boot Block Yes
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