W29GL032CT7S/TRAY

Winbond  W29GL032CT7S/TRAY technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

ECCN (US) 3A991.b.1.a
Automotive No
PPAP No
Cell Type NOR
Chip Density (bit) 32M
Block Organization Symmetrical
Location of Boot Block Top
Address Bus Width (bit) 21
Number of Bits/Word (bit) 8/16
Number of Words 4M/2MWord
Programmability Yes
Timing Type Asynchronous
Max. Access Time (ns) 70
Maximum Erase Time (S) 64/Chip
Maximum Page Access Time (ns) 30
Maximum Programming Time (ms) 56000/Chip
OE Access Time (ns) 35
Interface Type Parallel
Minimum Operating Supply Voltage (V) 2.7
Typical Operating Supply Voltage (V) 3|3.3
Maximum Operating Supply Voltage (V) 3.6
Programming Voltage (V) 2.7 to 3.6
Operating Current (mA) 55
Page Read Current (mA) 25
Program Current (mA) 30
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Command Compatible Yes
ECC Support No
Support of Page Mode Yes
Mounting Surface Mount
Package Height 1
Package Width 18.4
Package Length 12
PCB changed 48
Supplier Package TSOP
Packaging Tape and Reel
Part Status Obsolete
Pin Count 48
Architecture Sectored
Sector Size 64Kbyte x 64
Page Size 8Words/16byte
Boot Block Yes
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