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W25X20CVSNAG/REEL Tech Specifications

Winbond  W25X20CVSNAG/REEL technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

EU RoHS Compliant
ECCN (US) EAR99
Automotive Yes
PPAP Unknown
Chip Density (bit) 2M
Block Organization Symmetrical
Address Bus Width (bit) 24
Number of Bits/Word (bit) 8Bits/Word (bit)s
Number of Words 256KWord
Programmability Yes
Timing Type Synchronous
Max. Access Time (ns) 8
Maximum Erase Time (S) 2/Chip
Maximum Programming Time (ms) 3/Page
Interface Type Serial (SPI, Dual SPI)
Minimum Operating Supply Voltage (V) 2.6
Typical Operating Supply Voltage (V) 3.3
Maximum Operating Supply Voltage (V) 3.6
Operating Current (mA) 14
Program Current (mA) 15
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 105
Supplier Temperature Grade Automotive
Command Compatible No
ECC Support No
Support of Page Mode No
Minimum Endurance (Cycles) 100000
Mounting Surface Mount
Package Height 1.5(Max)
Package Width 4(Max)
Package Length 5(Max)
PCB changed 8
Standard Package Name SOP
Supplier Package SOIC
Lead Shape Gull-wing
Part Status Unconfirmed
Pin Count 8
Architecture Sectored
Sector Size 4Kbyte x 64
Page Size 256byte
Boot Block No
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