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W25X20CLUXIG TR/REEL Tech Specifications

Winbond  W25X20CLUXIG TR/REEL technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

EU RoHS Compliant
ECCN (US) EAR99
Automotive No
PPAP No
Cell Type NOR
Chip Density (bit) 2M
Block Organization Symmetrical
Location of Boot Block Bottom|Top
Address Bus Width (bit) 24
Number of Bits/Word (bit) 8Bits/Word (bit)s
Number of Words 256KWord
Programmability Yes
Timing Type Synchronous
Max. Access Time (ns) 8
Maximum Erase Time (S) 2/Chip
Maximum Programming Time (ms) 0.8/Page
Interface Type Serial (SPI, Dual SPI)
Minimum Operating Supply Voltage (V) 2.3
Typical Operating Supply Voltage (V) 2.5|3|3.3
Maximum Operating Supply Voltage (V) 3.6
Programming Voltage (V) 2.3 to 3.6
Operating Current (mA) 14
Program Current (mA) 12
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Command Compatible Yes
ECC Support No
Support of Page Mode No
Mounting Surface Mount
Package Height 0.53
Package Width 3
Package Length 2
PCB changed 8
Standard Package Name SON
Supplier Package USON
Part Status Active
Pin Count 8
Architecture Sectored
Sector Size 4Kbyte x 64
Page Size 256byte
Boot Block Yes
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