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W541E261 Tech Specifications

Winbond  W541E261 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 80Terminals
Part Life Cycle Code Transferred
Ihs Manufacturer WINBOND ELECTRONICS CORP
Part Package Code QFP
Package Description QFP, QFP80,.7X.9,32
Clock Frequency-Max 4.19 MHz
Number of I/O Lines 21I/O Lines
Operating Temperature-Max 70 °C
Package Body Material PLASTIC/EPOXY
Package Code QFP
Package Equivalence Code QFP80,.7X.9,32
Package Shape RECTANGULAR
Package Style FLATPACK
RAM(byte) 64
ROM(word) 2048
Supply Voltage-Max 5.5 V
Supply Voltage-Min 2.2 V
Supply Voltage-Nom 3 V
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Terminal Pitch 0.8 mm
Reach Compliance Code unknown
Pin Count 80
JESD-30 Code R-PQFP-G80
Qualification Status Not Qualified
Temperature Grade COMMERCIAL
Speed 4 MHz
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Supply Current-Max 0.6 mA
Bit Size 4
Has ADC NO
DMA Channels NO
PWM Channels NO
DAC Channels NO
On Chip Program ROM Width 8
ROM Programmability FLASH
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W541E261 Documents

Download datasheets and manufacturer documentation for   W541E261

  • Datasheets
W541E261 brand manufacturers: Winbond Electronics Corp, Twicea stock, W541E261 reference price.Winbond Electronics Corp. W541E261 parameters, W541E261 Datasheet PDF and pin diagram description download.You can use the W541E261 Embedded - Microcontrollers, DSP Datesheet PDF, find W541E261 pin diagram and circuit diagram and usage method of function,W541E261 electronics tutorials.You can download from the Twicea.