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W25X64BVZEIG Tech Specifications

Winbond  W25X64BVZEIG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 8Terminals
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP
Part Package Code SON
Package Description 8 X 6 MM, GREEN, WSON-8
Clock Frequency-Max (fCLK) 80 MHz
Number of Words 8388608 wordsWord
Number of Words Code 8000000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code HVSON
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Supply Voltage-Nom (Vsup) 3 V
ECCN Code EAR99
HTS Code 8542.32.00.51
Terminal Position DUAL
Terminal Form NO LEAD
Number of Functions 1Function
Terminal Pitch 1.27 mm
Reach Compliance Code unknown
Pin Count 8
JESD-30 Code R-PDSO-N8
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 2.7 V
Operating Mode SYNCHRONOUS
Organization 8MX8
Output Characteristics 3-STATE
Seated Height-Max 0.8 mm
Memory Width 8
Memory Density 67108864 bit
Parallel/Serial SERIAL
Memory IC Type FLASH
Programming Voltage 3 V
Length 8 mm
Width 6 mm
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