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W25X20CVUXBG

Winbond  W25X20CVUXBG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 8Terminals
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer WINBOND ELECTRONICS CORP
Package Description USON-8
Clock Frequency-Max (fCLK) 80 MHz
Number of Words 262144 wordsWord
Number of Words Code 256000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code HVSON
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Supply Voltage-Nom (Vsup) 3 V
ECCN Code EAR99
HTS Code 8542.32.00.51
Terminal Position DUAL
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Terminal Pitch 0.5 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PDSO-N8
Supply Voltage-Max (Vsup) 3.6 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 2.6 V
Operating Mode SYNCHRONOUS
Organization 256KX8
Output Characteristics 3-STATE
Seated Height-Max 0.6 mm
Memory Width 8
Memory Density 2097152 bit
Screening Level AEC-Q100
Parallel/Serial SERIAL
Memory IC Type FLASH
Programming Voltage 3 V
Length 3 mm
Width 2 mm

W25X20CVUXBG

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