Winbond Electronics Corp W25Q80VSSIG Memory Modules
W25Q80VSSIG
2736-630-W25Q80VSSIG
RoHS Compliant
Flash, 1MX8, PDSO8, 0.208 INCH, GREEN, PLASTIC, SOIC-8
In Stock Min. : 1
Mult. : 1
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W25Q80VSSIG Tech Specifications
Winbond W25Q80VSSIG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | YES | |
| Number of Terminals | 8Terminals | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Part Package Code | SOIC | |
| Package Description | SOP, | |
| Clock Frequency-Max (fCLK) | 80 MHz | |
| Moisture Sensitivity Levels | 3 | |
| Number of Words | 1048576 wordsWord | |
| Number of Words Code | 1000000Words Codes | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Shape | SQUARE | |
| Package Style | SMALL OUTLINE | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| JESD-609 Code | e3 | |
| Pbfree Code | Yes | |
| ECCN Code | EAR99 | |
| Terminal Finish | Matte Tin (Sn) | |
| HTS Code | 8542.32.00.51 | |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 1Function | |
| Terminal Pitch | 1.27 mm | |
| Reach Compliance Code | compliant | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Pin Count | 8 | |
| JESD-30 Code | S-PDSO-G8 | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Temperature Grade | INDUSTRIAL | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Operating Mode | SYNCHRONOUS | |
| Organization | 1MX8 | |
| Output Characteristics | 3-STATE | |
| Seated Height-Max | 2.16 mm | |
| Memory Width | 8 | |
| Memory Density | 8388608 bit | |
| Parallel/Serial | SERIAL | |
| Memory IC Type | FLASH | |
| Programming Voltage | 3 V | |
| Length | 5.28 mm | |
| Width | 5.28 mm |
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