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ISD4003-04MPY Tech Specifications

Winbond  ISD4003-04MPY technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount NO
Number of Terminals 28Terminals
Ihs Manufacturer WINBOND ELECTRONICS CORP
Part Package Code DIP
Package Description DIP, DIP28,.6
Operating Temperature-Max 70 °C
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Part Life Cycle Code Transferred
HTS Code 8542.39.00.01
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Number of Functions 1Function
Terminal Pitch 2.54 mm
Reach Compliance Code unknown
Pin Count 28
JESD-30 Code R-PDIP-T28
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.3 V
Temperature Grade COMMERCIAL
Supply Voltage-Min (Vsup) 2.7 V
Supply Current-Max 40 mA
Seated Height-Max 4.83 mm
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG
Reading Time-Max 240 s
On Chip Memory Type FLASH
Length 36.83 mm
Width 15.24 mm
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ISD4003-04MPY Documents

Download datasheets and manufacturer documentation for   ISD4003-04MPY

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