ISD33180SI Tech Specifications

Winbond  ISD33180SI technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 28Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP
Part Package Code SOIC
Package Description 0.300 INCH, PLASTIC, SOIC-28
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code SOP
Package Equivalence Code SOP28,.4
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
JESD-609 Code e0
Terminal Finish TIN LEAD
HTS Code 8542.39.00.01
Terminal Position DUAL
Terminal Form GULL WING
Number of Functions 1Function
Terminal Pitch 1.27 mm
Reach Compliance Code not_compliant
Pin Count 28
JESD-30 Code R-PDSO-G28
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.3 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 2.7 V
Supply Current-Max 40 mA
Seated Height-Max 2.65 mm
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG
Reading Time-Max 194.5 s
On Chip Memory Type EEPROM
Length 17.9 mm
Width 7.5 mm
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ISD33180SI Documents

Download datasheets and manufacturer documentation for   ISD33180SI

  • Datasheets
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