Winbond Electronics Corp ISD33150P Audio Special Purpose ICs DUAL
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ISD33150P Tech Specifications
Winbond ISD33150P technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | NO | |
| Number of Terminals | 28Terminals | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Part Package Code | DIP | |
| Package Description | 0.600 INCH, PLASTIC, DIP-28 | |
| Operating Temperature-Max | 70 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| JESD-609 Code | e0 | |
| Terminal Finish | TIN LEAD | |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | DUAL | |
| Terminal Form | THROUGH-HOLE | |
| Number of Functions | 1Function | |
| Terminal Pitch | 2.54 mm | |
| Reach Compliance Code | not_compliant | |
| Pin Count | 28 | |
| JESD-30 Code | R-PDIP-T28 | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 3.3 V | |
| Temperature Grade | COMMERCIAL | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Current-Max | 40 mA | |
| Seated Height-Max | 4.83 mm | |
| Consumer IC Type | SPEECH SYNTHESIZER WITH RCDG | |
| Reading Time-Max | 155.6 s | |
| On Chip Memory Type | EEPROM | |
| Length | 36.83 mm | |
| Width | 15.24 mm |
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