Winbond Electronics Corp ISD1112X Audio Special Purpose ICs UPPER
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ISD1112X Tech Specifications
Winbond ISD1112X technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | YES | |
| Number of Terminals | 28Terminals | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Part Package Code | DIE | |
| Package Description | DIE, | |
| Operating Temperature-Max | 50 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | DIE | |
| Package Equivalence Code | DIE OR CHIP | |
| Package Shape | RECTANGULAR | |
| Package Style | UNCASED CHIP | |
| Applications | CAR STEREO; HANDSET; TRANSFORMER | |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | UPPER | |
| Terminal Form | NO LEAD | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Reach Compliance Code | unknown | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Pin Count | 28 | |
| JESD-30 Code | R-XUUC-N28 | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 6.5 V | |
| Temperature Grade | COMMERCIAL | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Consumer IC Type | SPEECH SYNTHESIZER WITH RCDG | |
| Reading Time-Max | 12 s | |
| On Chip Memory Type | EEPROM |
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