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W987D6HBGX6E Tech Specifications

Winbond  W987D6HBGX6E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 54-TFBGA
Surface Mount YES
Memory Types Volatile
Operating Temperature -25°C~85°C TC
Packaging Tray
Published 2011
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 54Terminations
Additional Feature AUTO/SELF REFRESH
Voltage - Supply 1.7V~1.95V
Terminal Position BOTTOM
Number of Functions 1Function
Supply Voltage 1.8V
Terminal Pitch 0.8mm
JESD-30 Code R-PBGA-B54
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.95V
Power Supplies 1.8V
Supply Voltage-Min (Vsup) 1.7V
Memory Size 128Mb 8M x 16
Number of Ports 1Port
Operating Mode SYNCHRONOUS
Clock Frequency 166MHz
Access Time 5.4ns
Memory Format DRAM
Memory Interface Parallel
Organization 8MX16
Output Characteristics 3-STATE
Memory Width 16
Write Cycle Time - Word, Page 15ns
Standby Current-Max 0.00001A
Memory Density 134217728 bit
I/O Type COMMON
Refresh Cycles 4096
Sequential Burst Length 1248FP
Interleaved Burst Length 1248
Length 9mm
Height Seated (Max) 1.025mm
Width 8mm
RoHS Status ROHS3 Compliant
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W987D6HBGX6E Documents

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