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W971GG6SB25I Tech Specifications

Winbond  W971GG6SB25I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 84-TFBGA
Surface Mount YES
Number of Pins 84Pins
Memory Types Volatile
Operating Temperature -40°C~95°C TC
Packaging Tray
Published 2011
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 84Terminations
Additional Feature AUTO/SELF REFRESH
Voltage - Supply 1.7V~1.9V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Supply Voltage 1.8V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Operating Supply Voltage 1.8V
Supply Voltage-Max (Vsup) 1.9V
Supply Voltage-Min (Vsup) 1.7V
Memory Size 1Gb 64M x 16
Number of Ports 1Port
Operating Mode SYNCHRONOUS
Clock Frequency 200MHz
Access Time 400ps
Memory Format DRAM
Memory Interface Parallel
Organization 64MX16
Memory Width 16
Write Cycle Time - Word, Page 15ns
Address Bus Width 13b
Density 1 Gb
Length 12.5mm
Height Seated (Max) 1.2mm
RoHS Status ROHS3 Compliant
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W971GG6SB25I Documents

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