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W66BQ6NBUAGJ TR Tech Specifications

Winbond  W66BQ6NBUAGJ TR technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 200-WFBGA
Supplier Device Package 200-WFBGA (10x14.5)
Mfr Winbond Electronics
Package Tape & Reel (TR)
Product Status Active
Memory Types Volatile
Base Product Number W66BQ6
Maximum Clock Frequency 1.866 GHz
Maximum Operating Temperature + 105 C
Supply Voltage-Max 1.95 V
Minimum Operating Temperature - 40 C
Supply Voltage-Min 1.06 V
Mounting Styles SMD/SMT
Series -
Operating Temperature -40°C ~ 105°C (TC)
Type SDRAM - LPDDR4X
Voltage - Supply 1.06V ~ 1.17V, 1.7V ~ 1.95V
Memory Size 2Gbit
Clock Frequency 1.866 GHz
Access Time 3.5 ns
Memory Format DRAM
Memory Interface LVSTL_11
Data Bus Width 16 bit
Organization 128 M x 16
Write Cycle Time - Word, Page 18ns
Memory Organization 128M x 16
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