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W66BM6NBUAFJ Tech Specifications

Winbond  W66BM6NBUAFJ technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 200-WFBGA
Supplier Device Package 200-WFBGA (10x14.5)
Mfr Winbond Electronics
Package Tray
Product Status Not For New Designs
Memory Types Volatile
Base Product Number W66BM6
Series -
Operating Temperature -40°C ~ 105°C (TC)
Voltage - Supply 1.06V ~ 1.17V, 1.7V ~ 1.95V
Memory Size 2Gbit
Clock Frequency 1.6 GHz
Access Time 3.5 ns
Memory Format DRAM
Memory Interface LVSTL_11
Write Cycle Time - Word, Page 18ns
Memory Organization 128M x 16
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