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W29N02GVSIAA Tech Specifications

Winbond  W29N02GVSIAA technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 48-TFSOP (0.724, 18.40mm Width)
Number of Pins 48Pins
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tray
Published 2011
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 48Terminations
ECCN Code 3A991.B.1.A
Terminal Finish Tin (Sn)
HTS Code 8542.32.00.51
Voltage - Supply 2.7V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Supply Voltage 3.3V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Operating Supply Voltage 3V
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 2Gb 256M x 8
Operating Mode ASYNCHRONOUS
Memory Format FLASH
Memory Interface Parallel
Organization 2GX1
Memory Width 1
Write Cycle Time - Word, Page 25ns
Density 2 Gb
Page Size 256B
Ambient Temperature Range High 85°C
Height 1.2mm
Length 18.4mm
Width 12mm
RoHS Status ROHS3 Compliant
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W29N02GVSIAA Documents

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