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W29N01HZBINF TR Tech Specifications

Winbond  W29N01HZBINF TR technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 63-VFBGA
Supplier Device Package 63-VFBGA (9x11)
Mfr Winbond Electronics
Package Tape & Reel (TR)
Product Status Active
Memory Types Non-Volatile
Base Product Number W29N01
Supply Voltage-Nom (Vsup) 1.7V - 1.95V
Moisture Sensitive Yes
Maximum Operating Temperature + 85 C
Supply Voltage-Max 1.95 V
Minimum Operating Temperature - 40 C
Factory Pack QuantityFactory Pack Quantity 2500
Active Read Current - Max 25 mA
Supply Voltage-Min 1.7 V
Mounting Styles SMD/SMT
Interface Type Parallel
Manufacturer Winbond
Brand Winbond
RoHS Details
Series -
Operating Temperature -40°C ~ 85°C (TA)
Packaging Reel
Type SLC NAND Flash
Subcategory Memory & Data Storage
Voltage - Supply 1.7V ~ 1.95V
Memory Size 1Gbit
Speed 40MHz
Supply Current-Max 25 mA
Access Time 22 ns
Memory Format FLASH
Memory Interface ONFI
Data Bus Width 8 bit
Organization High Quality Single Level Cell (SLC) Technology Standard ONFI NAND Command Set
Write Cycle Time - Word, Page 25ns
Product Type NAND Flash
Memory Density 1Gb
Product Category NAND Flash
Temperature 40ºC ~ 85ºC / -40ºC ~ 105ºC
Memory Organization 128M x 8
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