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W29GL032CB7S Tech Specifications

Winbond  W29GL032CB7S technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 14 Weeks
Mounting Type Surface Mount
Package / Case 48-TFSOP (0.724, 18.40mm Width)
Surface Mount YES
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tray
Published 2016
JESD-609 Code e3
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 48Terminations
ECCN Code 3A991.B.1.A
Terminal Finish MATTE TIN
Additional Feature BOTTOM BOOT BLOCK
HTS Code 8542.32.00.51
Voltage - Supply 2.7V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Supply Voltage 3V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 48
JESD-30 Code R-PDSO-G48
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3/3.3V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 32Mb 4M x 8 2M x 16
Operating Mode ASYNCHRONOUS
Memory Format FLASH
Memory Interface Parallel
Organization 32MX1
Memory Width 1
Write Cycle Time - Word, Page 70ns
Standby Current-Max 0.000005A
Memory Density 33554432 bit
Access Time (Max) 70 ns
Programming Voltage 3V
Alternate Memory Width 8
Data Polling YES
Toggle Bit YES
Command User Interface YES
Number of Sectors/Size 863Sectors/Sizes
Sector Size 8K64K
Page Size 8/16words
Ready/Busy YES
Boot Block BOTTOM
Common Flash Interface YES
Length 18.4mm
Height Seated (Max) 1.2mm
Width 12mm
RoHS Status ROHS3 Compliant
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W29GL032CB7S Documents

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