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W25X40CLSSIG Tech Specifications

Winbond  W25X40CLSSIG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 8-SOIC (0.209, 5.30mm Width)
Surface Mount YES
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tube
Series SpiFlash®
Published 2016
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 8Terminations
ECCN Code EAR99
Additional Feature IT ALSO OPERATES AT 2.3 V AT 80 MHZ
HTS Code 8542.32.00.51
Voltage - Supply 2.3V~3.6V
Terminal Position DUAL
Number of Functions 1Function
Supply Voltage 3V
Terminal Pitch 1.27mm
Pin Count 8
JESD-30 Code S-PDSO-G8
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 2.7V
Interface SPI, Serial
Memory Size 4Mb 512K x 8
Operating Mode SYNCHRONOUS
Clock Frequency 104MHz
Memory Format FLASH
Memory Interface SPI
Organization 4MX1
Memory Width 1
Write Cycle Time - Word, Page 800μs
Memory Density 4194304 bit
Programming Voltage 2.7V
Length 5.28mm
Height Seated (Max) 2.16mm
Width 5.28mm
RoHS Status ROHS3 Compliant
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W25X40CLSSIG Documents

Download datasheets and manufacturer documentation for   W25X40CLSSIG

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