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W25X10CLSNIG Tech Specifications

Winbond  W25X10CLSNIG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Package / Case 8-SOIC (0.154, 3.90mm Width)
Mounting Type Surface Mount
Mount Surface Mount
Number of Pins 8Pins
Memory Types Non-Volatile
Published 2006
Series SpiFlash®
Packaging Tube
Operating Temperature -40°C~85°C TA
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 8Terminations
ECCN Code EAR99
Voltage - Supply 2.3V~3.6V
Terminal Position DUAL
Number of Functions 1Function
Supply Voltage 3V
Terminal Pitch 1.27mm
Pin Count 8
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 2.5/3.3V
Supply Voltage-Min (Vsup) 2.7V
Interface SPI, Serial
Memory Size 1Mb 128K x 8
Nominal Supply Current 14mA
Clock Frequency 104MHz
Access Time 8 ns
Memory Format FLASH
Memory Interface SPI
Organization 1MX1
Memory Width 1
Write Cycle Time - Word, Page 800μs
Address Bus Width 24b
Density 8 Mb
Standby Current-Max 0.000005A
Sync/Async Synchronous
Programming Voltage 3V
Serial Bus Type SPI
Endurance 100000 Write/Erase Cycles
Data Retention Time-Min 20
Write Protection HARDWARE/SOFTWARE
Page Size 256B
Length 4.9mm
Height Seated (Max) 1.75mm
RoHS Status ROHS3 Compliant
Radiation Hardening No
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W25X10CLSNIG Documents

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