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W25Q64JVSSIQ Tech Specifications

Winbond  W25Q64JVSSIQ technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-SOIC (0.209, 5.30mm Width)
Number of Pins 8Pins
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tube
Series SpiFlash®
Published 2016
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 8Terminations
ECCN Code 3A991.B.1.A
Terminal Finish Matte Tin (Sn) - annealed
Voltage - Supply 2.7V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Supply Voltage 3V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 30
Operating Supply Voltage 3V
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 2.7V
Interface SPI
Memory Size 64Mb 8M x 8
Operating Mode SYNCHRONOUS
Clock Frequency 133MHz
Access Time 6 ns
Memory Format FLASH
Memory Interface SPI - Quad I/O
Organization 64MX1
Memory Width 1
Write Cycle Time - Word, Page 3ms
Address Bus Width 24b
Density 512 Mb
Parallel/Serial SERIAL
Programming Voltage 2.7V
Page Size 256B
Ambient Temperature Range High 85°C
Height 2.16mm
Length 5.23mm
RoHS Status ROHS3 Compliant
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