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W25Q64FVSSIQ Tech Specifications

Winbond  W25Q64FVSSIQ technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 8-SOIC (0.209, 5.30mm Width)
Surface Mount YES
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tube
Series SpiFlash®
Published 2016
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 8Terminations
Voltage - Supply 2.7V~3.6V
Terminal Position DUAL
Number of Functions 1Function
Terminal Pitch 1.27mm
JESD-30 Code S-PDSO-G8
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 3V
Memory Size 64Mb 8M x 8
Operating Mode SYNCHRONOUS
Clock Frequency 104MHz
Memory Format FLASH
Memory Interface SPI - Quad I/O, QPI
Organization 8MX8
Output Characteristics 3-STATE
Memory Width 8
Write Cycle Time - Word, Page 50μs, 3ms
Standby Current-Max 0.00005A
Memory Density 67108864 bit
Parallel/Serial SERIAL
Serial Bus Type SPI
Data Retention Time-Min 20
Write Protection HARDWARE/SOFTWARE
Alternate Memory Width 1
Length 5.28mm
Height Seated (Max) 2.16mm
Width 5.28mm
RoHS Status ROHS3 Compliant
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W25Q64FVSSIQ Documents

Download datasheets and manufacturer documentation for   W25Q64FVSSIQ

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