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W25Q64BVSSIG Tech Specifications

Winbond  W25Q64BVSSIG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-SOIC (0.209, 5.30mm Width)
Number of Pins 8Pins
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tube
Series SpiFlash®
Published 2010
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 8Terminations
ECCN Code 3A991.B.1.A
Voltage - Supply 2.7V~3.6V
Terminal Position DUAL
Number of Functions 1Function
Supply Voltage 3V
Terminal Pitch 1.27mm
Pin Count 8
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 2.7V
Interface SPI, Serial
Memory Size 64Mb 8M x 8
Nominal Supply Current 18mA
Clock Frequency 80MHz
Access Time 7 ns
Memory Format FLASH
Memory Interface SPI
Memory Width 8
Write Cycle Time - Word, Page 3ms
Address Bus Width 1b
Density 64 Mb
Standby Current-Max 0.000005A
Sync/Async Synchronous
Word Size 1b
Programming Voltage 2.7V
Serial Bus Type SPI
Endurance 100000 Write/Erase Cycles
Data Retention Time-Min 20
Write Protection HARDWARE/SOFTWARE
Page Size 256B
Height Seated (Max) 2.16mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
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W25Q64BVSSIG Documents

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