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W25Q32FWZPIG

Winbond  W25Q32FWZPIG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 14 Weeks
Mounting Type Surface Mount
Package / Case 8-WDFN Exposed Pad
Surface Mount YES
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tube
Series SpiFlash®
Published 2016
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 8Terminations
Voltage - Supply 1.65V~1.95V
Terminal Position DUAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Supply Voltage 1.8V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PDSO-N8
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.95V
Power Supplies 1.8V
Supply Voltage-Min (Vsup) 1.65V
Interface SPI, Serial
Memory Size 32Mb 4M x 8
Operating Mode SYNCHRONOUS
Clock Frequency 104MHz
Memory Format FLASH
Memory Interface SPI - Quad I/O, QPI
Organization 4MX8
Memory Width 8
Write Cycle Time - Word, Page 60μs, 5ms
Standby Current-Max 0.00002A
Memory Density 33554432 bit
Programming Voltage 1.8V
Serial Bus Type SPI
Endurance 100000 Write/Erase Cycles
Data Retention Time-Min 20
Write Protection HARDWARE/SOFTWARE
Alternate Memory Width 1
Length 6mm
Height Seated (Max) 0.8mm
Width 5mm
RoHS Status ROHS3 Compliant

W25Q32FWZPIG

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