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W25Q32FVSSIG Tech Specifications

Winbond  W25Q32FVSSIG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-SOIC (0.209, 5.30mm Width)
Number of Pins 8Pins
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tube
Series SpiFlash®
Published 2012
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN Code 3A991.B.1.A
Voltage - Supply 2.7V~3.6V
Pin Count 8
Interface SPI
Memory Size 32Mb 4M x 8
Nominal Supply Current 20mA
Clock Frequency 104MHz
Access Time 7 ns
Memory Format FLASH
Memory Interface SPI - Quad I/O, QPI
Write Cycle Time - Word, Page 50μs, 3ms
Address Bus Width 24b
Density 32 Mb
Sync/Async Synchronous
Word Size 8b
Ambient Temperature Range High 85°C
Height 2.16mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
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W25Q32FVSSIG Documents

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