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W25Q256FVEIG Tech Specifications

Winbond  W25Q256FVEIG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 14 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-WDFN Exposed Pad
Number of Pins 8Pins
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tube
Series SpiFlash®
Published 2016
Part Status Discontinued
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 8Terminations
Voltage - Supply 2.7V~3.6V
Terminal Position DUAL
Number of Functions 1Function
Supply Voltage 3V
Terminal Pitch 1.27mm
Qualification Status Not Qualified
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 2.7V
Interface SPI
Memory Size 256Mb 32M x 8
Nominal Supply Current 20mA
Clock Frequency 104MHz
Access Time 7 ns
Memory Format FLASH
Memory Interface SPI - Quad I/O, QPI
Organization 256MX1
Memory Width 1
Write Cycle Time - Word, Page 50μs, 3ms
Address Bus Width 1b
Density 256 Mb
Standby Current-Max 0.000025A
Parallel/Serial SERIAL
Sync/Async Synchronous
Word Size 8b
Programming Voltage 3V
Serial Bus Type SPI
Endurance 100000 Write/Erase Cycles
Data Retention Time-Min 20
Write Protection HARDWARE/SOFTWARE
Ambient Temperature Range High 85°C
Height 800μm
RoHS Status ROHS3 Compliant
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W25Q256FVEIG Documents

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