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W25Q16DVSNIG Tech Specifications

Winbond  W25Q16DVSNIG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Number of Pins 8Pins
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tube
Series SpiFlash®
Published 2008
Part Status Discontinued
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 8Terminations
Voltage - Supply 2.7V~3.6V
Terminal Position DUAL
Number of Functions 1Function
Supply Voltage 3V
Terminal Pitch 1.27mm
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3/3.3V
Supply Voltage-Min (Vsup) 2.7V
Interface SPI, Serial
Memory Size 16Mb 2M x 8
Nominal Supply Current 18mA
Clock Frequency 104MHz
Access Time 7 ns
Memory Format FLASH
Memory Interface SPI - Quad I/O
Memory Width 8
Write Cycle Time - Word, Page 50μs, 3ms
Address Bus Width 24b
Density 16 Mb
Standby Current-Max 0.000005A
Sync/Async Synchronous
Word Size 8b
Programming Voltage 2.7V
Serial Bus Type SPI
Endurance 100000 Write/Erase Cycles
Data Retention Time-Min 20
Write Protection HARDWARE/SOFTWARE
Length 5mm
Height Seated (Max) 1.75mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
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W25Q16DVSNIG Documents

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