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W25P16VSSIG Tech Specifications

Winbond  W25P16VSSIG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 8-SOIC (0.209, 5.30mm Width)
Surface Mount YES
Number of Pins 8Pins
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tube
Series SpiFlash®
Published 2006
JESD-609 Code e3
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 8Terminations
ECCN Code EAR99
Terminal Finish MATTE TIN
Voltage - Supply 2.7V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Supply Voltage 3V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 40
Pin Count 8
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3/3.3V
Supply Voltage-Min (Vsup) 2.7V
Interface SPI, Serial
Memory Size 16Mb 2M x 8
Clock Frequency 50MHz
Access Time 50 μs
Memory Format FLASH
Memory Interface SPI
Organization 16MX1
Memory Width 1
Write Cycle Time - Word, Page 7ms
Address Bus Width 1b
Density 16 Mb
Standby Current-Max 0.000005A
Programming Voltage 2.7V
Serial Bus Type SPI
Endurance 100000 Write/Erase Cycles
Data Retention Time-Min 20
Write Protection HARDWARE/SOFTWARE
Length 5.27mm
Height Seated (Max) 2.16mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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W25P16VSSIG Documents

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