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W25N02JWZEIF Tech Specifications

Winbond  W25N02JWZEIF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 8-WDFN Exposed Pad
Supplier Device Package 8-WSON (8x6)
Mfr Winbond Electronics
Package Tray
Product Status Active
Memory Types Non-Volatile
Base Product Number W25N02
Supply Voltage-Nom (Vsup) 1.7V-1.95V
Moisture Sensitive Yes
Timing Type Asynchronous
Maximum Operating Temperature + 85 C
Supply Voltage-Max 1.95 V
Minimum Operating Temperature - 40 C
Factory Pack QuantityFactory Pack Quantity 126
Supply Voltage-Min 1.7 V
Mounting Styles SMD/SMT
Interface Type SPI
Manufacturer Winbond
Brand Winbond
Tradename SpiStack
RoHS Details
Operating Temperature -40°C ~ 85°C (TA)
Type QspiNAND Flash
Subcategory Memory & Data Storage
Voltage - Supply 1.7V ~ 1.95V
Memory Size 2Gbit
Speed STR166MHz / DTR83MHz
Clock Frequency 166 MHz
Supply Current-Max 35 mA
Memory Format FLASH
Memory Interface SPI - Quad I/O, DTR
Data Bus Width 8 bit
Organization SPI / QPI / DTR , On-Chip ECC
Write Cycle Time - Word, Page 700μs
Product Type NAND Flash
Memory Density 2Gb
Product Category NAND Flash
Temperature 40ºC ~ 85ºC / -40ºC ~ 105ºC
Memory Organization 256M x 8
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