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W968D6DAGX7I Tech Specifications
Winbond W968D6DAGX7I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Package / Case | VFBGA-54 | |
| Mounting Type | Surface Mount | |
| Surface Mount | YES | |
| Supplier Device Package | 54-VFBGA (6x8) | |
| Number of Terminals | 54Terminals | |
| Supply Voltage-Nom (Vsup) | 1.8V/1.8V | |
| Moisture Sensitive | Yes | |
| Maximum Clock Frequency | 133 MHz | |
| Maximum Operating Temperature | + 85 C | |
| Supply Voltage-Max | 1.95 V | |
| Unit Weight | 0.059311 oz | |
| Minimum Operating Temperature | - 40 C | |
| Factory Pack QuantityFactory Pack Quantity | 480 | |
| Supply Voltage-Min | 1.7 V | |
| Mounting Styles | SMD/SMT | |
| Manufacturer | Winbond | |
| Brand | Winbond | |
| RoHS | Details | |
| Package | Tray | |
| Base Product Number | W968D6 | |
| Mfr | Winbond Electronics | |
| Product Status | Last Time Buy | |
| Memory Types | Volatile | |
| Package Description | VFBGA-54 | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Number of Words Code | 16000000Words Codes | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | BGA54,6X9,30 | |
| Operating Temperature-Min | -40 °C | |
| Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Access Time-Max | 70 ns | |
| Operating Temperature-Max | 85 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | W968D6DAGX7I | |
| Number of Words | 16777216 wordsWord | |
| Package Code | VFBGA | |
| Package Shape | RECTANGULAR | |
| Part Life Cycle Code | Active | |
| Samacsys Description | DRAM 256M pSRAM x16, ADP, 133MHz, Ind temp | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Risk Rank | 2.24 | |
| Series | W968D6DA | |
| Packaging | Tray | |
| Operating Temperature | -40°C ~ 85°C (TC) | |
| Type | Pseudo SRAM | |
| HTS Code | 8542.32.00.71 | |
| Subcategory | Memory & Data Storage | |
| Technology | PSRAM (Pseudo SRAM) | |
| Voltage - Supply | 1.7V ~ 1.95V | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Terminal Pitch | 0.75 mm | |
| Reach Compliance Code | compliant | |
| JESD-30 Code | R-PBGA-B54 | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 1.95 V | |
| Power Supplies | 1.8 V | |
| Temperature Grade | INDUSTRIAL | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Memory Size | 256 Mbit | |
| Speed | 166MHz | |
| Operating Mode | SYNCHRONOUS | |
| Clock Frequency | 133 MHz | |
| Supply Current-Max | 40 mA | |
| Access Time | 70 ns | |
| Memory Format | PSRAM | |
| Memory Interface | Parallel | |
| Data Bus Width | 16 bit | |
| Organization | 16Mb x16 CRAM-ADM | |
| Output Characteristics | 3-STATE | |
| Seated Height-Max | 1 mm | |
| Memory Width | 16 | |
| Write Cycle Time - Word, Page | - | |
| Product Type | DRAM | |
| Standby Current-Max | 0.000025 A | |
| Memory Density | 256Mb | |
| I/O Type | COMMON | |
| Memory IC Type | MEMORY CIRCUIT | |
| Product Category | DRAM | |
| Temperature | -40ºC~85ºC | |
| Memory Organization | 16M x 16 | |
| Width | 6 mm | |
| Length | 8 mm |
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