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W79E825ADG

Winbond  W79E825ADG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount NO
Number of Terminals 20Terminals
Product Status Obsolete
Mfr Bivar Inc.
Package Bag
Package Description DIP, DIP20,.3
Package Style IN-LINE
Package Body Material PLASTIC/EPOXY
Package Equivalence Code DIP20,.3
Operating Temperature-Min -40 °C
Supply Voltage-Nom 5 V
Supply Voltage-Min 4.5 V
Operating Temperature-Max 85 °C
Rohs Code Yes
Manufacturer Part Number W79E825ADG
RAM(byte) 256
Clock Frequency-Max 20 MHz
Package Code DIP
Package Shape RECTANGULAR
Manufacturer Nuvoton Technology Corp
ROM(word) 16384
Part Life Cycle Code Obsolete
Number of I/O Lines 18I/O Lines
Ihs Manufacturer NUVOTON TECHNOLOGY CORP
Supply Voltage-Max 5.5 V
Risk Rank 5.81
Part Package Code DIP
Series *
Additional Feature ALSO OPERATES AT 2.7V MIN SUPPLY AT 12 MHZ
Subcategory Microcontrollers
Technology CMOS
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Reach Compliance Code compliant
Pin Count 20
JESD-30 Code R-PDIP-T20
Qualification Status Not Qualified
Power Supplies 3/5 V
Temperature Grade INDUSTRIAL
Speed 20 MHz
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Supply Current-Max 25 mA
Bit Size 8
Has ADC YES
DMA Channels NO
PWM Channels YES
DAC Channels NO
Seated Height-Max 4.45 mm
On Chip Program ROM Width 8
CPU Family 8051
ROM Programmability FLASH
Width 7.62 mm
Length 20.06 mm
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